Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment

Gong, Xiaochun; Wei, Bin; Teng, Jianwei; Wang, Zhongchang; Li, Yunping

doi:10.1016/j.corsci.2021.109686

Cited by 16 publications

(5 citation statements)

References 40 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Figure b compares the surface morphologies of the patterns before and after storage at 100 °C, which only shows darker color rather than large areas of oxidized color after storage . It is known that Ag species shows better stability at high temperature because the formation enthalpy of Ag oxides (−31.1 kJ/mol) is significantly higher than that of Cu-oxides (−169 kJ/mol for Cu 2 O and −158 kJ/mol for CuO) . Furthermore, the introduced Ag species also can block exposure of Cu within the structure to the aerobic environment, thereby improving the overall oxidation resistance of the structure.…”

Section: Resultsmentioning

confidence: 99%

“…20 It is known that Ag species shows better stability at high temperature because the formation enthalpy of Ag oxides (−31.1 kJ/mol) is significantly higher than that of Cu-oxides (−169 kJ/mol for Cu 2 O and −158 kJ/mol for CuO). 42 Furthermore, the introduced Ag species also can block exposure of Cu within the structure to the aerobic environment, thereby improving the overall oxidation resistance of the structure. Figure 6c further compares the thermal stabilities of patterns with different Ag content storage at 160 °C.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Zhou

Guo

Sun

et al. 2023

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

Bimetallic Cu−Ag conductive structures hold great promise in integrating flexible electronics, but fabrication of these structures requires complex multistep processes with poor controllability. Herein, we develop a one-step laser writing process for manufacturing the flexible Cu−Ag conductive structure from a metallic salt. The effect of laser parameters and precursor traits on the writing process, as well as the joining mechanism of Cu−Ag nanostructures, has been discussed systematically. The fabricated Cu−Ag structure not only exhibits remarkable conductivity with a resistivity of ∼8 μΩ cm but also has excellent oxidation and electrochemical migration resistances. Flexible electronic devices fabricated from these written structures, such as the flexible heater, were demonstrated as a proof of concept, thereby demonstrating excellent stability even in high-humidity-and-temperature working conditions.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: ■ Results and Discussionmentioning

confidence: 99%

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Zhou

Guo

Sun

et al. 2023

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

show abstract

“…В сплаве Cu-5Ag (мас. %) после старения при температуре 450 °C наблюдали сетку из выделений серебра вдоль границ зерен [26]. В сплаве Cu-8Ag (мас.…”

Section: обсуждение результатовunclassified

The influence of deformation at cryogenic or room temperature followed by annealing on the structure and properties of copper and its Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys

Novikova,

Kostina,

Salamatov

et al. 2023

FMT

View full text Add to dashboard Cite

Due to low electrical resistivity, the Cu–Pd and Cu–Pd–Ag system alloys can be used as corrosion-resistant conductors of weak electrical signals. The paper deals with a comparison of the structure and physical-mechanical properties of Cu, Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys after deformation at room or cryogenic temperature followed by annealing. The authors studied specimens in different initial states: quenched, deformed at room and cryogenic temperatures. To study the processes of structure rearrangement and the evolution of properties, annealing was carried out in the temperature range from 100 to 450 °C, followed by cooling in water. The duration of heat treatments was 1 h. The dependences of the yield strength and elongation to failure on the annealing temperature showed that cryodeformation significantly increases the thermal stability of the structure of both pure copper and the Cu–3Pd–3Ag ternary alloy. According to the temperature dependence of specific electrical resistivity of the deformed Cu–3Pd–3Ag alloy during heating at a rate of 120 deg./h, it was found that the decrease in electrical resistance caused by recrystallization begins at above 300 °C. The dependences of specific electrical resistivity on true strain showed that the structure rearrangement mechanisms during deformation are different for pure copper and the Cu–3Pd–3Ag alloy. The results of mathematical processing of the peaks in the diffraction patterns established that two phases appear in the Cu–3Pd–3Ag alloy after cryodeformation and annealing, one of which is silver-enriched, and the other is depleted. The study showed that during annealing of the deformed (especially after cryodeformation) Cu–3Pd–3Ag alloy, an anomalous increase in strength properties is observed. It was identified that alloying copper with palladium and silver leads to an increase in the recrystallization temperature. Thus, copper alloys with small palladium and silver additives are obviously attractive for practical applications, since they have improved strength properties, satisfactory electrical conductivity, and a higher recrystallization temperature compared to pure copper.

show abstract

“…As shown in Table 3, the oxygen content, nitrogen content, and electrical conductivity of the alloy are insufficient. e oxidation behavior of the second phase can have an important effect on the alloy properties [80,81]. e CuCr alloys prepared by aluminothermic reductionmagnetoelectric coupling refining-water and gas composite cooling were assembled into 12 kV high-power vacuum interrupters, as shown in Figure 26.…”

Section: Aluminothermic Reduction-magnetoelectric Coupling Refining-w...mentioning

confidence: 99%

Progress in the Preparation of Large-Size High-Performance CuCr Alloys

Han

Zhang

et al. 2022

Advances in Materials Science and Engineering

View full text Add to dashboard Cite

CuCr contact material, whose mass fraction of Cr is generally in the range of 25% to 50%, is one of the most desirable contact materials for medium- and high-voltage vacuum switches. The homogeneity and denseness of CuCr alloy are the keys to its application. The infiltration and powder sintering have defects, such as uneven distribution of Cr phase, and great difficulties in preparing high-performance CuCr alloys with low gas content; the equipment investment in the vacuum consumable arc melting method is large and the production cost is high, while mechanical alloying, vacuum induction melting, and laser-selective melting as new technologies are still in the laboratory stage. From the perspective of surface modification treatment and multicomponent alloying, refinement of Cr phase grains can improve the properties of CuCr alloy. The new process of aluminothermic reduction-electromagnetic coupling refining-water and gas composite rapid cooling takes oxides as raw material and obtains a fully miscible CuCr alloy melt by aluminothermic reduction theoretically at 2848K, followed by secondary refining under electromagnetic field coupling and water-gas composite cooling and casting, which can obtain alloy ingots of 50 mm in diameter and 10 mm in height. The density and hardness of CuCr alloy prepared by this process as vacuum contact material are better than the requirements of GB/T 26867-2011, so this process has the potential to become a new-generation preparation method for large-size homogeneous high-performance CuCr alloy.

show abstract

Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment

Cited by 16 publications

References 40 publications

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

The influence of deformation at cryogenic or room temperature followed by annealing on the structure and properties of copper and its Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys

Progress in the Preparation of Large-Size High-Performance CuCr Alloys

Contact Info

Product

Resources

About