Relation between the Solidification Condition and Volume Fraction of Rod-Like Eutectic Cu&lt;sub&gt;6&lt;/sub&gt;Sn&lt;sub&gt;5&lt;/sub&gt; Phase in the Eutectic Structure in Sn-Cu Alloys

Esaka, Hisao; Machida, Junichi; Takamatsu, Yoshiko; Shinozuka, Kei

doi:10.2320/matertrans.m2014427

Cited by 3 publications

(4 citation statements)

References 20 publications

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“…This is discussed in a related article. 13) The volume fraction of the eutectic Cu 6 Sn 5 obtained in a Sn-1.15 mass% Cu alloy eutectic structure at a growth velocity of 55.6 µm/s was 3.02%.…”

Section: Experimental Results With Changing Measurement Areamentioning

confidence: 91%

Estimation Procedure for Volume Fraction of Minor and Rod Phase Aligned Unidirectionally in a Matrix

2015

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Knowing the volume fraction of a minor phase in a composite material is important for characterizing its mechanical properties. Assuming that a rod-like phase with a constant diameter is aligned but dispersed randomly in a matrix, a mathematical model for estimating the volume fraction of a rod-like phase has been developed. This model predicts how many rods are required for an accurate estimation of volume fraction. One of the effective features of this model is that the real dimensions do not need to be considered due to the similarity of their shape. According to this model, it is sufficient to measure the area that includes at least 20 rods to estimate an accurate value for volume fraction. This prediction was confirmed by measuring a unidirectionally solidified Sn-Cu eutectic alloy system.

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Section: Experimental Results With Changing Measurement Areamentioning

confidence: 91%

Estimation Procedure for Volume Fraction of Minor and Rod Phase Aligned Unidirectionally in a Matrix

2015

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“…In this way, it is possible to incorporate the effects of G. The shapes of the coupled zones designed with both cooling rate and solidification velocity are quite similar if considered a same alloy system. It is worth noting that the thermocouples used in the present experiments (Esaka et al, 2015;Ventura et al, 2011Ventura et al, , Çadırlı et al, 2010Ventura et al, , Çadırlı et al, 2009Machida et al, 2006) considering the coupled zone concept within the mold are very thin, do not have a ceramic coating and are in thermal equilibrium with the molten alloy before the water is activated to cool the bottom of the directionally solidified casting. The reduced diameter of the thermocouples and the high frequency of acquisition with output records each 0.2 s guarantee reliable measurements even for positions associated with higher v and G.…”

Section: Resultsmentioning

confidence: 91%

“…To research specific microstructures related to given alloy compositions and processing conditions of Sn-Cu and Sn-Bi alloys, a lot of researches have examined the structure/ interface evolution during solidification through expressing solidification (interface) velocity, v, and temperature gradient, G (Esaka et al, 2015;Ventura et al, 2011Ventura et al, , Çadırlı et al, 2010Ventura et al, , Çadırlı et al, 2009Machida et al, 2006;Shen et al, 2019;Gibbs et al, 2016;Zhang et al, 2015;Gusakova et al, 2014;Wang et al, 2014;Xiaowu et al, 2012;Xu et al, 2011Xu et al, , Çadırlı et al, 2009Braga et al, 2007). Each of these studies is limited to a certain range of compositions and a set of solidification velocities, usually carried out with a fixed value of G. Kurz (2001) demonstrated the importance of implementing a combination of microstructure x process mappings.…”

Section: Introductionmentioning

confidence: 99%

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Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

Kakitani

Silva

et al. 2021

SSMT

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Purpose Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity. Design/methodology/approach Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, Ṫ, data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added. Findings When analyzing the cooling rate (Ṫ = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) + cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. Originality/value The present paper is devoted to the establishment of (v vs. G) + cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product.

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In-Situ Characterization of Dendrite Tip Radius in Sn-Base Alloys

Yoshimura

Morishita

Yasuda

et al. 2018

J. Japan Inst. Metals and Materials

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The solidification processes for Sn-2Ag alloy and Sn-2Ag-0.6Zn alloy have been directly observed in-situ using time-resolved X-ray imaging at SPring-8. In case of low cooling rate, the solidification condition is in coupled zone, the primary (β-Sn) has been overgrown by the eutectic structure. In case of other cooling conditions, the solidification of primary (β-Sn) dendrites and interdendritic eutectic structure have been observed. The dendrite tip radii have been characterized. It was found that the dendrite tip radius decreased as the growth velocity increased. The tip radius in Sn-2Ag-0.6Zn alloy is found to be smaller than that in Sn-2Ag alloy, when the growth velocity is the same. The values of tip radius agreed well with the previous results which were obtained using the unidirectional solidification and quenching technique.

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Relation between the Solidification Condition and Volume Fraction of Rod-Like Eutectic Cu<sub>6</sub>Sn<sub>5</sub> Phase in the Eutectic Structure in Sn-Cu Alloys

Cited by 3 publications

References 20 publications

Estimation Procedure for Volume Fraction of Minor and Rod Phase Aligned Unidirectionally in a Matrix

Estimation Procedure for Volume Fraction of Minor and Rod Phase Aligned Unidirectionally in a Matrix

Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

In-Situ Characterization of Dendrite Tip Radius in Sn-Base Alloys

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