Large area (up to 0.2 cm 2) Ga 2 O 3 rectifiers without edge termination were fabricated on a Si-doped n-Ga 2 O 3 drift layer grown by halide vapor phase epitaxy on a Sn-doped n + Ga 2 O 3 (001) substrate. A forward current of 2.2 A was achieved in single-sweep voltage mode, a record for Ga 2 O 3 rectifiers. The on-state resistance was 0.26 • cm 2 for these largest diodes, decreasing to 5.9 × 10-4 • cm 2 for 40 × 40 μm 2 devices. The temperature dependence (25°C-125°C) of forward current density was used to extract the barrier height of 1.08 eV for Ni and a Richardson's constant of 48 A • cm −2 • K-2. Ideality factors were in the range 1.01-1.05, with the barrier height decreasing with temperature. The reverse breakdown was a strong function of diode area, decreasing from 466 V (1.6 × 10 −5 cm 2) to 15 V for 0.2 cm 2. This led to power figureof-merits (V 2 B /R ON) in the range 3.68 × 10 8-865 W • cm −2 over this area range. The reverse breakdown voltage scaled approximately as the contact perimeter, indicating it was dominated by the surface and decreased with temperature with a negative temperature coefficient of 0.45 V • K −1. The reverse recovery time when switching from +1 V to reverse bias was 34 ns.