Relationship between grinding process and the parameters of subsurface damage based on the image processing

Abstract

Grinding is the main process step for the highprecision optical components, and its process parameters may bring forth subsurface damage to some degrees on the surfaces and finally result in the variation of the mechanical and optical properties of the components. In this paper, the ground sample is etched to expose the micro cracks and the characterization parameters of the subsurface damage are extracted using the image processing method. To investigate the influence of main grinding parameters on the micro cracks of subsurface damage, relationships among the average abrasive size, grinding force, wheel speed, and grinding depth and characterization parameters (length, angle, and density) of micro cracks are established. The results show that the influence of grinding parameters on the micro crack's length is consistent with that on the surface roughness. The average abrasive size and grinding force have obvious influence on the subsurface damage and surface roughness than wheel speed and grinding depth. Micro cracks' angle and density are almost not affected by the grinding parameters.

Intelligent vehicle modeling design based on image processing

“…In 2012, the previous researchers proposed relative total variation to remove the repeated texture with small mesoscale. 4,5 Eliminate fine-grained repetitive textures by fusing the appropriate image structure of the dynamic boot diagram and the static boot diagram. Although the algorithm used for texture removal is still sensitive to image structure, texture edges are different from stylized edges, and texture removal algorithms may still fail when used to generate stylized images.…”

Effect of micro-crack and reaction product on laser damage performance of optical glass during chemical etching

“…Some defects are usually generated below the surface of optical glass during their grinding and polishing processes. These defects are referred to as subsurface damage (SSD), which is dominated by subsurface micro-cracks [1][2] . In the field of high-power laser applications, subsurface micro-cracks can greatly reduce the laser damage performance of optical glass, which is usually used as transmitting lens or debris shield [3][4] .…”