Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is reviewed as a practical guide for materials scientists. First, analytical and computational models of TBC are reviewed. Five measurement methods are then compared in terms of their sensitivity to TBC: the 3ω method, frequency-and time-domain thermoreflectance, the cut-bar method, and a composite effective thermal conductivity method. The heart of the review surveys 30 years of TBC measurements around room temperature, highlighting the materials science factors experimentally proven to influence TBC. These factors include the bulk dispersion relations, acoustic contrast, and interfacial chemistry and bonding. The measured TBCs are compared across a wide range of materials systems by using the maximum transmission limit, which with an attenuated transmission coefficient proves to be a good guideline for most clean, strongly bonded interfaces. Finally, opportunities for future research are discussed.

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“…This approach has been used in two ways: (a) lattice dynamics simulations (36,53,65) and (b) wave packet transmission calculations (66,67).…”

Section: Reciprocal Space Modelsmentioning

confidence: 99%

Thermal Boundary Conductance: A Materials Science Perspective

Monachon

Weber

Dames

2016

Annu. Rev. Mater. Res.

221

140

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“…3 can serve as a validation of our previous potential development for MD simulations. 35,36 Furthermore, the thermal boundary conductance between Au FIG. 3.…”

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confidence: 99%

Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K

Donovan

Szwejkowski

Duda

et al. 2014

Applied Physics Letters

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Thermal boundary conductance is of critical importance to gallium nitride (GaN)-based device performance. While the GaN-substrate interface has been well studied, insufficient attention has been paid to the metal contacts in the device. In this work, we measure the thermal boundary conductance across interfaces of Au, Al, and Au-Ti contact layers and GaN. We show that in these basic systems, metal-GaN interfaces can impose a thermal resistance similar to that of GaN-substrate interfaces. We also show that these thermal resistances decrease with increasing operating temperature and can be greatly affected by inclusion of a thin adhesion layers.

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“…We observe that the two commonly applied models, the acoustic mismatch model (AMM) and diffuse mismatch model (DMM), do not necessarily lead to values that are comparable to the available experimental data [1,15,17,18]. In all cases, it is clear that the shapes of embedded elements and/or interfaces have an important impact on the TBR [5], [6], [10] [19], [20].…”

Section: Introductionmentioning

confidence: 84%

Phononic thermal resistance due to a finite periodic array of nano-scatterers

Nghiem

Chapuis

2016

Journal of Applied Physics

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The wave property of phonons is employed to explore the thermal transport across a finite periodic array of nano-scatterers such as circular and triangular holes. As thermal phonons are generated in all directions, we study their transmission through a single array for both normal and oblique incidences, using a linear dispersionless time-dependent acoustic frame in a two-dimensional system. Roughness effects can be directly considered within the computations without relying on approximate analytical formulae. Analysis by spatio-temporal Fourier transform allows us to observe the diffraction effects and the conversion of polarization. Frequency-dependent energy transmission coefficients are computed for symmetric and asymmetric objects. We demonstrate that the phononic array acts as an efficient thermal barrier by applying the theory of thermal boundary (Kapitza) resistances to arrays of smooth scattering holes in silicon for an exemplifying periodicity of 10 nm in the [5-100 K] temperature range. It is observed that the associated thermal conductance has the same temperature dependence than that without phononic filtering.

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Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

Cited by 89 publications

References 79 publications

Thermal Boundary Conductance: A Materials Science Perspective

Thermal Boundary Conductance: A Materials Science Perspective

Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K

Phononic thermal resistance due to a finite periodic array of nano-scatterers

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