Relative dielectric permittivity of calcium aluminate cement-glass microsphere composites

Sliva, Paul; Gururaja, T.R.; Scheetz, Barry E.

doi:10.1016/0167-577x(86)90041-8

Cited by 12 publications

(1 citation statement)

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“…2 ' 3 Recently, hollow ceramic/glass microspheres have been used to fabricate low dielectric constant materials by the introduction of controlled porosity to meet the increased demand for high performance multichip module (MCM's) substrates in the microelectronic packaging industry. 4 " 6 As the time of flight of electronic signals is an important factor gating the design of high speed electronic systems, reducing the dielectric constant of the propagating media would reduce the time of flight for these signals. Reducing the dielectric constant by incorporating hollow ceramic/glass microspheres with diameters of the order of the grain size of the sintered ceramic (1-10 (im) would be an attractive new material for the microelectronics industry.…”

Section: Introductionmentioning

confidence: 99%

Factors influencing the formation of hollow ceramic microspheres by water extraction of colloidal droplets

Liu¹,

Wilcox²

1995

J. Mater. Res.

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Hollow ceramic microspheres of A1 2 O 3 , SiO 2 , and mullite have been prepared by the combination of an emulsion technique with a water extraction sol-gel method. Concentration of sol, initial droplet size, and water extraction rate of the system are found to be the important process parameters controlling the size and wall thickness of the hollow microspheres, and their influences are shown. A model that correlates the morphology of microspheres to concentration and water extraction rate is proposed and is in good agreement with the experimental observations. The capability and limitation of this process for forming hollow microspheres are demonstrated. It was shown that hollow microspheres with sizes greater than 5 fim could be readily prepared, while a limitation was met for sizes less than 1 /xm, in which case solid microspheres were normally formed.

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Section: Introductionmentioning

confidence: 99%