Reliability

Licari, James J.; Swanson, Dale W.

doi:10.1016/b978-1-4377-7889-2.10006-3

Cited by 24 publications

(28 citation statements)

References 8 publications

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“…From literature, it has been found that OH stretching vibrations from DGEBA epoxy resin is found at 3500 cm –1 (Scheme ). − These observations indicate that some of the ether bonds between bisphenol A and diglycidyl ether were broken through cleavage at position 1 (Scheme ), thus producing bisphenol A. The precipitate might thus contain both larger fragments of DGEBA epoxy resin and bisphenol A.…”

Section: Resultsmentioning

confidence: 99%

“…Instead, a broad peak around 3283 cm –1 and a peak around 2930–2870 cm –1 were observed. The peaks at 2930–2870 cm –1 correspond to CH 2 –CH 3 stretching vibrations of bisphenol A diglycidyl ether (DGEBA) epoxy resin, and the peak at 3283 cm –1 corresponds to the characteristic Ph–OH stretching vibration from bisphenol A (Scheme ), found by running a spectra of bisphenol A/P/F (Figure , right). From literature, it has been found that OH stretching vibrations from DGEBA epoxy resin is found at 3500 cm –1 (Scheme ).…”

Section: Resultsmentioning

confidence: 99%

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Characterization of the Liquid Products from Hydrolyzed Epoxy and Polyester Resin Composites Using Solid-Phase Microextraction and Recovery of the Monomer Phthalic Acid

Sokoli

Simonsen

Nielsen

et al. 2016

Ind. Eng. Chem. Res.

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A method to recover the fibers and monomers from epoxy-based and unsaturated polyester-based composites and characterize the liquid products using solid-phase microextraction has been investigated in this study. Experiments were performed using near-critical water in a batch reactor (1 L) at temperatures and pressures up to 350 °C and 170 bar. In-situ sampling was performed. The samples collected at temperatures in the range of 300 to 350 °C were divided into an aqueous phase and an oil phase. It was possible to identify various phenolic and aromatic compounds in both phases. In the samples collected during degradation of the polyester composites, the monomer phthalic acid precipitated nearly purified at temperatures in the range of 250−325 °C. By the recovery of fibers, an oil product, and the possibility to recover phthalic acid, the polymer composite end-of-life cycle is a step closer to completion.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Characterization of the Liquid Products from Hydrolyzed Epoxy and Polyester Resin Composites Using Solid-Phase Microextraction and Recovery of the Monomer Phthalic Acid

Sokoli

Simonsen

Nielsen

et al. 2016

Ind. Eng. Chem. Res.

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“…Similar to spring mechanics, the adhesive material will have a spring constant that is related to the material flexibility, and a displacement related to the linear shrinkage factor of the curing process [3][4][5]14]. Flexible materials with low linear shrinkage will exert low stress on the ferrite, where increasing the linear shrinkage or the rigidity of the cured adhesive will increase the applied stress on the ferrite.…”

Section: Ferrites and Stressmentioning

confidence: 99%

“…If the thickness of the core material is chosen as the maximum for the given target substrate for embedding, then material permeability is the only remaining way to adjust device inductance. The process of ferrite embedding introduces encapsulation stresses on the ferrite cores [3][4][5]. External mechanical pressure from the cured adhesives can significantly reduce the effective permeability of the ferrite.…”

Section: Introductionmentioning

confidence: 99%

Inductance Maximization by Mitigation of Encapsulation Stresses of PCB Embedded Ferrite Broadband Transformers

2016

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The maximization of bandwidth in broadband magnetic devices, done reliably in mass production, has led to a strong industry interest in substrate embedded ferrite core materials with windings fabricated by photolithography. Ferrites, when embedded within a substrate, can lose significant magnetic permeability due to stress from the cured bonding adhesive. In this paper, an experimental survey is conducted, encapsulating sample ferrites in various types of bonding adhesive and measuring the change in the ferrite core's inductance. The adhesives include epoxies, cyanoacrylates, polyurethanes, and silicone sealants, and each adhesive is evaluated on curing procedural limitations, bonding strength, and resulting loss in inductance when used as a ferrite encapsulant. Though trade-offs exist, the best choice based on bonding strength and minimal loss of inductance was found to be a low shrinkage, rigid epoxy.

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“…Generally, there are three different types of electrically conductive adhesives, which are used in the industry of circuits fabrication: isotropic conductive adhesive (ICA), anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) [23]. Most adhesives consist of a base, which is made from polymer, such as epoxy, acrylate, and fillers from a variety of materials depending on the applications [24]. Adhesives of all these three types used in the industry are mostly hardened by loading thermal energy.…”

Section: Uv-curing Adhesivesmentioning

confidence: 99%

Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

et al. 2015

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In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests.

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Reliability

Cited by 24 publications

References 8 publications

Characterization of the Liquid Products from Hydrolyzed Epoxy and Polyester Resin Composites Using Solid-Phase Microextraction and Recovery of the Monomer Phthalic Acid

Characterization of the Liquid Products from Hydrolyzed Epoxy and Polyester Resin Composites Using Solid-Phase Microextraction and Recovery of the Monomer Phthalic Acid

Inductance Maximization by Mitigation of Encapsulation Stresses of PCB Embedded Ferrite Broadband Transformers

Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

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