Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads

Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jinlong; Li, Xingji; Paik, Kyung‐Wook

doi:10.1109/ectc32696.2021.00221

Search citation statements

Order By: Relevance

Paper Sections

Select...

Mems Reliability With Consideration Of Temperature1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article2

Relationship

Self Cite0

Independent2

Authors

Journals

Cited by 2 publications

(1 citation statement)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the thermal-shock coupling, the maximum stress at the connections will keep rising. Shuye Zhang et al used COMSOL Multiphysics to analyze the mechanical performance of MEMS devices subjected to the coupled load of thermal cycling from −55 °C to 125 °C and 1500 g, 1 ms half-sine pulse shock [ 92 ]. Thermal stress and shock stress tend to cause stress concentration at the same position of the structure, enhancing the damage.…”

Section: Mems Reliability With Consideration Of Temperaturementioning

confidence: 99%