Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

Automotive Radar — From First Efforts to Future Systems

“…Surface-mount packages like the eWLB shown in Fig. 13 have proven to be low-cost and reliable, while providing good RF performance of the chip-to-PCB transition up to 80 GHz [58]. The chip is placed into a mold compound that forms the package, with the contacts of the chip facing to the surface.…”

Design for the Package-Board Transition and Its Testability Design in the Fan-Out Wafer-Level Package

“…Since being introduced by Infineon in 2001 [1], because of the advantages of better thermal and electrical performance, lower cost, and good feasibility, fan-out wafer-level package (FOWLP) technology has been widely used in millimeter-wave applications [2][3][4][5][6][7][8]. Thanks to the researchers, various types of FOWLP have emerged: Freescale proposed the redistributed chip package in 2007 [9], IME extended the technology to multi-die packaging in 2008 [10] and demonstrated the reliability of 3D FOWLP [11], a package-on-package concept with the FOWLP was proposed by STATS ChipPAC in 2012 [12], TSMC also developed their InFo wafer-level packaging [13,14] at basic of the FOWLP, and in 2014, the Infineon applied the through encapsulant via (TEV) in embedded wafer level ball grid array (eWLB) for vertical interconnection [15].…”

“…Currently, the transition for chip-package-board or package-board in FOWLP have been studied by many researchers, like in [4,5,[24][25][26]. In [4], a channel from microstrip on the chip to microstrip on PCB was simulated, and the simulated loss is about 2 dB from 56 GHz to 70 GHz.…”

“…In [4], a channel from microstrip on the chip to microstrip on PCB was simulated, and the simulated loss is about 2 dB from 56 GHz to 70 GHz. In [5], at 77 GHz, a chip-package-board RF transition with the insertion loss of about 1 dB and return loss of about 20 dB was achieved in the eWLB package for the automotive radar transceiver. However, the measurement technique and results for the transition in FOWLP have been rarely reported.…”