Reliability assessment of MEMS switches for space applications: laboratory and launch testing

Abstract

A novel combination of ground-based and flight tests was employed to examine the reliability of capacitive radio-frequency microelectromechanical switches for use in space applications. Laboratory tests were initially conducted to examine the thermomechanical effects of packaging and space-like thermal stresses on the pull-in voltage of the devices; during this process it was observed that operational stability is highly dependent on the geometrical design of the switch and this must be taken in to account during the design stage. To further expose the switches to acceleration levels experienced during a space mission, they were launched on board a sounding rocket and then subjected to free-fall from a height of over 1.3 km with a resulting impact of over 3500g. Post launch analysis indicates that the switches are remarkably resilient to high levels of acceleration. Some evidence is also present to indicate that time-dependent strain relaxation in die attach epoxy materials may contribute to minor variations in device shape and performance.

Smartphone CanSat for Actualization of Real-time Streaming Video Calls Using Remote Screen Touch System with Shape Memory Alloy Actuator

“…6) Its functionality in an extremely small package promises to yield numerous advanced technologies required for achieving challenging mission-related functions such as sub-orbital experiments, 7) scientific investigations, 8) atmospheric science testing, 9) and verification of new technologies. 10) CanSats can be sent to a certain target altitude using model rockets, balloons, UAVs, airplanes, helicopters, or basically anything with flight capability. A model rocket is generally used for the actual flight test of a CanSat.…”

Long-term lifetime prediction for RF-MEMS switches

“…Among many other applications, RF-MEMS switches are very attractive for satellite networks [6][7][8]. In this case, additional and more demanding characteristics are required because the device has to retain its functionality for years without degradation and then be ready to open very quickly when needed.…”

Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

“…Warpage of printed circuit boards (PCBs) can cause significant problems during manufacturing processes and reduce the reliability of the product. Many problems have been reported including damage and mismatching of components, disconnection of solder paste bridging, cracking of solder joints, and line jams during production [1][2][3][4]. Nowadays, it has become critically important to design electronic devices that are lighter and smaller in size.…”

“…Also, multi-layer PCBs are used extensively to integrate more chips. Therefore, the relative impact of warpage on electronic products has increased [3,5]. For these reasons, the warpage of multi-layer PCBs must be accurately predicted and controlled to improve the reliability of electronic product components.…”