Reliability concerns in high temperature electronic systems

McCluskey, Patrick; Grybowski, R.R.; Condra, Lloyd W.; Das, Diganta; Fink, Johannes Karl; Jordan, J.; Torri, T.

doi:10.1109/htemds.1998.730698

Cited by 13 publications

(7 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This also implies modification of most of the converter components (active and passive) for an environment where the ambient temperature can easily exceed 200°C, as is usually studied. 4 With the aim of developing power converters that can operate safely at an ambient temperature of 300°C, this article focuses on one part of the assembly-the substrate. The substrate has several functions, including ensuring electrical insulation between the active components and the baseplate (which is generally grounded) while favoring the removal of losses generated by the dies (during both switching and conduction periods).…”

Section: Introductionmentioning

confidence: 99%

Ceramic Substrates for High-temperature Electronic Integration

Chasserio

Guillemet‐Fritsch

Lebey

et al. 2008

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

Ceramic Substrates for High-temperature Electronic Integration

Chasserio

Guillemet‐Fritsch

Lebey

et al. 2008

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…Therefore, the limitation on temperature has become a severe constraint in the development of electronic systems for oil and gas drilling applications. However, recent advances in components and packaging material technology have made it possible to design electronic systems that will operate at ambient temperatures of 200°C (392°F), without the need for active cooling (McCluskey et al 1998). However, from a cost-effectiveness perspective, ensuring these systems are reliable at this extreme temperature level with the combination of vibration impacts requires that reliability considerations be addressed in the design, manufacturing, operation monitoring, repair, and maintenance follow-up phases.…”

Section: Physics Of the Impact Of Temperaturementioning

confidence: 99%

Integrated PoF and CBM Strategies for Improving Electronics Reliability Performance of Downhole MWD and LWD Tools

Zhan

Ahmad

Heuermann-Kuehn

et al. 2010

SPE Annual Technical Conference and Exhibition

View full text Add to dashboard Cite

Electronics that operate under downhole drilling conditions, such as printed circuit board assemblies (PCBAs) in measurementwhile-drilling (MWD)/logging-while-drilling (LWD) tools, can experience a significant amount of extremely high temperatures and vibration stresses over their lifetimes, which may induce failures during deployment. This study demonstrates the methodologies on integrated physics of failure (PoF) for improving the reliability performance of MWD/LWD tools.PoF discussed in this study is for identifying and understanding failure modes, failure mechanisms, and failure sites of drilling electronics for their particular life-cycle loading conditions. This PoF study is a systematic methodology, integrated with data acquisition technologies, conditional-based maintenance (CBM) and failure analysis techniques to actualize the real-time life management on improving maintenance decisions, and providing guidance to incorporate reliability into the well-planning and operation processes, thus enabling monetary savings for the oil company and the MWD/LWD service provider.Through data acquisition technologies, the drilling environmental profile is captured by the sensor and recorded in the memories of the MWD/LWD tool. Based on the drilling environmental profiles, the drilling stress and loading conditions are retrieved and calculated for estimating the remaining life of the drilling electronics. With CBM strategy, electronic units assessed with high risk results are excluded from being deployed to the field to avoid potential failure in the field. PoF is followed up to investigate the failure mechanism of units returned from field. Real-case studies on MWD/LWD tools operated onshore the U.S. and in the Asia Pacific region are presented.The objective of this study is to enable real-time electronics reliability assessment on MWD/LWD tools under their actual application conditions. When combined with PoF models, CBM strategy is capable of making continuously updated predictions on the remaining life of electronics based on the in-situ drilling environmental and operational conditions. IntroductionThe effectiveness of integrated PoF and CBM strategies could provide operational benefits through detecting and identifying the potential or early-stage electronics parts or system failures, and make the proactive repair or maintenance feasible. It will enable the field operations group to have capability to avoid downhole tool failures at the rig site, therefore reducing risk of failure and subsequently reducing associated costs.Compared to wireline applications, the LWD/MWD operation requires closer field control of downhole dynamics. From the sub level to individual PCBA level, use of a tracking system is highly recommended. This approach will make the real-time life management of LWD/MWD tools feasible through the remaining life calculation from bottom level to system level.Until now, to ensure the reliability performance of LWD/MWD tools, planned maintenance (PM) was adopted as the method for determining maintenanc...

show abstract

“…CTE changes dramatically when temperature increases from below to above T g . This can cause higher stress to circuit components and impair long-term reliability [32].…”

Section: B Underfills and Molding Compoundsmentioning

confidence: 99%

“…However, these properties of rubbers and gels greatly limit their mechanical protection against external forces [9]. Resins usually have high storage modulus, which can cause high thermomechanical stress when CTE-mismatch occurs between the encapsulant and the circuit components [30], [32]. Therefore, resin-based potting compounds and glob tops are preferred to have a CTE matching that of other circuit components.…”

Section: Potting Compounds and Glob Topsmentioning

confidence: 99%

“…In this paper, the recommended properties and limitations of conformal coatings [11]- [20], underfills [21]- [32], molding compounds [23], [32]- [54], potting compounds [1], [55]- [72], and glob tops [73]- [81] are surveyed to identify those with potentials for high-temperature operation. The survey focuses on crucial properties listed in technical data sheets, such as the range of operation temperature, dielectric strength, and so on.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

Yao

Lü

Boroyevich

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

103

View full text Add to dashboard Cite

Semiconductor encapsulation is crucial to electronic packaging because it provides protection against mechanical stress, electrical breakdown, chemical erosions, α radiations, and so on. Conventional encapsulants are only applicable below 150°C. However, with increasing demand for high-density and high-temperature packaging, encapsulants that are functional at or above 250°C are required. In this paper, five types of encapsulants, including conformal coatings, underfills, molding compounds, potting compounds, and glob tops, are surveyed. First, recommended properties and selection criteria of each type of encapsulant are listed. Second, standard test methods for several crucial properties, including glass-transition temperature (T g ), coefficient of thermal expansion (CTE), dielectric strength, and so on are reviewed. Afterward, commercial products with highoperation temperature are surveyed. However, the results of the survey reveal a lack of high-temperature encapsulants. Therefore, this paper reviews recent progress in achieving encapsulants with both high-temperature capability and satisfactory properties. Material compositions other than epoxy, such as polyimide (PI), bismaleimide (BMI), and cyanate ester (CE), are potential encapsulants for high-temperature (250°C) operation, although their CTE needs to be tailored to limit internal stress. Fillers are reported to be efficient in reducing the CTE. In addition, fillers may also have a beneficial impact on the thermal stability of silicone-based encapsulants, whose high-temperature capability is limited by their thermal instability. IndexTerms-Encapsulant, high-temperature, plastic integrated circuit packaging, power electronic packaging, semiconductor device packaging.

show abstract

Reliability concerns in high temperature electronic systems

Cited by 13 publications

References 2 publications

Ceramic Substrates for High-temperature Electronic Integration

Ceramic Substrates for High-temperature Electronic Integration

Integrated PoF and CBM Strategies for Improving Electronics Reliability Performance of Downhole MWD and LWD Tools

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

Contact Info

Product

Resources

About