Reliability evaluation of a new method developed for DSC curing kinetic model of epoxy resin

Jia, Hongli; Zhu, Yingdan; Yan, Chun Yan; Chen, Mingda; Chen, Gang; Liu, Dong

doi:10.1002/app.53986

Cited by 6 publications

(1 citation statement)

References 47 publications

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“…Obviously, the T i0 , T p0 , and T f0 values of the PHMIEP/E51/DDM blends were also slightly lower than those of the E51/DDM blend, which also suggested the relatively lower curing temperature and the higher curing reactivity of the PHMIEP/E51/DDM blends. In order to accurately compare the curing reactivity, Kissinger’s method (eqs S1–S3) was employed to calculate the apparent activation energy ( E a ), − reaction order ( n ), and preexponential factor ( A ) of the curing reaction, and the calculated results are given in Table S4.…”

Section: Resultsmentioning

confidence: 99%

High-Impact Epoxy Resins with Superior Hydrophobicity Toughened by Epoxy Functionalized Poly(olefin-alt-maleimide) Derivatives

Shen,

Chen,

Lin

et al. 2024

ACS Appl. Polym. Mater.

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The inherent disadvantages of low toughness and high brittleness severely limit the widespread applications of epoxy resins (EPs), and it is highly desirable to toughen EPs while maintaining their rigidity and thermal properties. Herein, a type of epoxy functionalized poly[1-hexene-alt-N-(2-methoxymethyl oxirane)maleimide] (PHMIEP) was specially designed and synthesized by the self-stabilized precipitation polymerization (2SP) of 1-hexene and maleic anhydride, followed by imidization, hydroxymethylation, and epoxidation. Due to the presence of both rigid cyclic maleimide units and flexible pendant butyl groups, epoxy functionalized PHMIEP can serve as an effective toughening modifier for EPs. With 4,4-diaminodiphenylmethane as the curing agent, the EPs with 5 phr PHMIEP showed a record-high impact strength and tensile strength of 54.04 kJ/m 2 and 95.84 MPa, which were 121 and 23% higher than the neat EPs, respectively. Moreover, the PHMIEP-modified EPs exhibited similar thermal stability and glass-transition temperature to those of the neat EPs. More impressively, the resultant EPs showed superior hydrophobicity in comparison to the unmodified EPs due to the incorporation of hydrophobic imide and alkyl segments. Furthermore, in order to reduce the preparation cost, complex olefinic mixtures derived from the cracking product of raffinate oil were used directly to replace 1-hexene. The EPs modified with poly[cracked raffinate oilalt-N-(2-methoxymethyl oxirane)maleimide] (PRMIEP) also showed excellent comprehensive properties. Due to the highly enhanced toughness, higher strength, and comparable thermal stability, the PHMIEP/PRMIEP-toughened EPs demonstrate great potential as a high-performance resin matrix for application in the fields of electronic packaging, coating, and engineering plastics.

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Section: Resultsmentioning

confidence: 99%

High-Impact Epoxy Resins with Superior Hydrophobicity Toughened by Epoxy Functionalized Poly(olefin-alt-maleimide) Derivatives

Shen,

Chen,

Lin

et al. 2024

ACS Appl. Polym. Mater.

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Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Zhang,

Liu,

Xia

et al. 2023

J of Applied Polymer Sci

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This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical‐graphical method determining the kinetic parameters. A modified Kamal model was developed by introducing a concept of the maximum degree of cure (DOC) and temperature‐depended kinetic parameters to describe the isothermal cure kinetics of the adhesive with a typical exothermic peak, and an extended Kamal model was further proposed by adding an initial‐phase‐control term to the modified Kamal model to describe the isothermal cure kinetics of the adhesive with two exothermic peaks. The results showed that the presented curing kinetics models with the determined parameters can precisely predict the evolutions of the DOC of the two thermoset adhesives in both anisothermal and isothermal modes.

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A stacking sequence optimization strategy for process‐induced deformation of multi‐layer thick asymmetric laminates

Jia,

Zhu,

Yan

et al. 2024

Polymer Composites

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The occurrence of process‐induced deformations of composites laminates is challenging for assembly accuracy and may lead to a service life reduction of parts. However, it can be obviously mitigated through different optimization strategies on the basis of the accurate curing process simulation. In this study, a stacking sequence optimization strategy is proposed and applied to multi‐layer thick asymmetric laminates. The shapes of deformed laminate plates are experimentally investigated in virtue of the three‐dimensional coordinate measuring machine. The thermo‐chemical–mechanical behaviors of plates are first verified through the comparisons of model predicted and experimental process‐induced deformations. Then the nonlinear control formula achieved through the regression model is proposed for the direct relationship between stacking sequences and process‐induced deformations. Finally, the required solutions are generated by solving the control formula. With the comparisons between the average deformations before and after optimizations, it is found that the magnitudes of deformations are significantly reduced, especially when the unoptimizated deformations are large.Highlights The thermo‐chemical–mechanical behavior can be described in the curing process simulation model. The deformed shapes of multi‐layer thick asymmetric laminate plates are measured by a three‐dimensional coordinate measuring machine. The stacking sequence optimization strategy is implemented by introducing a nonlinear control formula.

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Reliability evaluation of a new method developed for DSC curing kinetic model of epoxy resin

Cited by 6 publications

References 47 publications

High-Impact Epoxy Resins with Superior Hydrophobicity Toughened by Epoxy Functionalized Poly(olefin-alt-maleimide) Derivatives

High-Impact Epoxy Resins with Superior Hydrophobicity Toughened by Epoxy Functionalized Poly(olefin-alt-maleimide) Derivatives

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

A stacking sequence optimization strategy for process‐induced deformation of multi‐layer thick asymmetric laminates

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