2008
DOI: 10.1016/j.microrel.2008.07.029
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Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED

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Cited by 24 publications
(8 citation statements)
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“…Therefore, how to screen out the weak LED die is of significant importance. Dal Lago et al [5] measured the dynamic electroluminescence and current waveforms, and Jeong et al [6] did an accelerated life test and suggested a screening policy to screen the leakage LED.…”
Section: Introductionmentioning
confidence: 99%
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“…Therefore, how to screen out the weak LED die is of significant importance. Dal Lago et al [5] measured the dynamic electroluminescence and current waveforms, and Jeong et al [6] did an accelerated life test and suggested a screening policy to screen the leakage LED.…”
Section: Introductionmentioning
confidence: 99%
“…For mass production, we need a rapid method to screen out the leakage LED. The authors in Reference [6] suggested a screening criterion on the sub turn-on voltage, using the related larger leakage current which happened at the minor turn-on region and can be submitted to the auto tester. However, for those LED chips with weak anti-electrostatic ability, it is difficult to find some differences on the current-voltage curves, i.e., the LED dies with apparent I-V curve agree well with the ideal diode curve such that we cannot screen them out.…”
Section: Introductionmentioning
confidence: 99%
“…The other is accelerated tests measuring performance degradation. Using the accelerated life tests, Jeong et al 7 aimed to improve the reliability of an InGaN white LED backlight module which was used for the front display in a refrigerator case. Villanueva et al 8 described the methodology known as 'overstress life testing' for LEDs.…”
Section: Introductionmentioning
confidence: 99%
“…As per the information given in [1,[4][5][6][7][8][9][10], some of the key factors are; junction temperature, thermal resistance between chip & surrounding, damage or degradation of the plastic encapsulation material, semiconductor defects, humidity or moisture incursion, voltage or current fluctuation malfunction of components in the electronic driver, damage to the wire bonding that connect the LED & soldering defects, degradation of the phosphors or secondary illuminator and cyclic effect. Moreover as indicated in [1,[4][5][6][7][8][9][10], junction temperature, humidity or moisture inclusion, voltage & current fluctuation are the most dominant factors that affect the light output of the HBLEDs.…”
Section: Introductionmentioning
confidence: 99%