Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test

Athamneh, Raed Al; Hani, Dania Bani; Ali, Haneen; Hamasha, Sa’d

doi:10.1016/j.microrel.2019.113507

Cited by 28 publications

(11 citation statements)

References 25 publications

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“…Similarly, Athamneh et al [70] performed reliability modeling of aged SAC305 solder joints and found the hazard rate to have shape parameters greater than 2. Liu et al [71] showed that the interconnects undergo wear-out when subjected to vibrations, both at fixed and random frequencies.…”

Section: Wear-out Periodmentioning

confidence: 98%

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

et al. 2021

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The bathtub model has often been cited as a hazard rate profile that predicts not only human mortality but also the hazard rate of manufactured products. This paper examines the inapplicability of the bathtub model to predict the hazard rate of electronic components, products, and systems. The paper reviews various literature and uses numerous experiments and field failure data to support its argument. The factors affecting the hazard rate of electronics are then discussed, common hazard rate trends for electronics are identified, and recommendations for the assessment of hazard rates are given. This paper recommends that a preconceived model of hazard rate over time should not be used.

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Section: Wear-out Periodmentioning

confidence: 98%

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

et al. 2021

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“…There exist several substantial competing factors contributing to the degradation of the solder joints. Both individual and mutual impacts of such factors, e.g., the chemical compositions, temperature profiles and other physical properties, on the solder joint degradation have been widely accepted in the previous literature 24 , 35 – 38 . We propose and validate an artificial intelligence approach for reliability assessment of the solder joints, a novel correlation-driven neural network (CDNN) approach.…”

Section: Introductionmentioning

confidence: 99%

“…Employing Weibull-distributed data and non-linear hybrid models, Berni et al 22 claimed that the surface finishes of the printed circuit boards along with the geometry of the joint in common are the dominant influencers on the failure mechanism of the solder interconnection. Other related works typically focused on the reliability assessment of solder joints via conventional statistical methodologies [23][24][25] . Additionally, particular standards such as the MIL-HDBK-217 26 and IEEE 1,413.1 27 present the key statistical factors and methodologies for reliability assessment.…”

mentioning

confidence: 99%

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

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“…Also, some scholars quoted the classic failure physical models, such as strain and energy fatigue models, to assess solder mechanics performance. In [16] [17], Coffin-Manson model and Morrow model were used to identify the relationships between the mechanical data and fatigue life. In [18], Darveaux model was used to predict solder joint remaining life.…”

Section: Introductionmentioning

confidence: 99%

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

Jing

et al. 2020

IEEE Access

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Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test

Cited by 28 publications

References 25 publications

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

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