Reliability of Cu nanoparticle joint for high temperature power electronics

Ishizaki, Toshitaka; Kuno, A.; Tane, A.; Yanase, M.; Osawa, Fumiaki; Satoh, Toshifumi; Yamada, Yuri

doi:10.1016/j.microrel.2014.07.113

Cited by 36 publications

(2 citation statements)

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“…2,3 At present, Cu-Cu bonding receives significant interest both in academic research and industrial development because copper has excellent electrical and thermal conductivities as well as electro-migration resistance. 4 Most importantly, it is widely used in electronic manufacturing and is often considered as a low cost solution. [5][6][7] Researchers are attempting to lower the Cu-Cu bonding temperature via surface passivation or balancing the pressure and temperature during thermo-compression bonding.…”

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“…16 Additionally, nanoparticles always present a much higher cost due to its delicate synthesis process which may render them unsuitable for mass industrial production. 4 Hence, we study and develop a method of mixing copper micro-particles with copper nano-particles in an attempt to improve the paste packing density and to further enhance the paste quality. The micro-particles could prohibit cracks in nano-particle paste due to their large size; the nanoparticles in return are able to fill the interstitial space between the microparticles.…”

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Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Dai

Anantha

et al. 2016

Applied Physics Letters

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An enhanced copper paste, formulated by copper micro-and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nanopaste. In-situ temperature and resistance measurements indicate that the mixed paste has a lower densification temperature. Electrical study also shows a $12Â lower sheet resistance of 0.27 X/sq. In addition, scanning electron microscope image analysis confirms a $50% lower porosity, which is consistent with the thermal and electrical results. The 3:1 (micro:nano, wt. %) mixed paste is found to have the strongest synergistic effect. This phenomenon is discussed further. Consequently, the mixed paste is a promising material for potential low temperature 3D interconnects fabrication.

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