Reliability of embedding concepts for discrete passive components in organic circuit boards

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

Meier

Roellig

et al. 2013

Self Cite

Embedding of discrete passives or functional chips as bare dies has been successfully proven in the last years. The embedding technology provides multiple advantages when compared to conventional surface mount technology. As of today multiple possibilities to embed active devices in the substrate exist. One method has been selected here and a fully parameterized finite-element framework has been created to assess its reliability potential. It is shown how it is possible to represent even very complex geometries with features spanning over multiple orders of magnitude, while fulfilling the requirement of reasonable simulation time effort and the possibility to still extracting all necessary local simulation result information. Special attention has been given to the simulation sequence used for the proposed model. Because the embedding technology involves multiple temperature critical production process steps it is advised to transfer the residual stresses of the previous step into the following. This ensures simulation results with high quality. Furthermore it is proposed to update the geometries according to the process calculations. In this work a feasible modeling approach for the underfill curing process is given. With the proposed framework the structural behavior of an embedded IC component both during the manufacturing stage and under environmental loading conditions can be investigated. This will facilitate future design choices and help expose the reliability potential of the novel embedding technology compared to conventional SMT

Section: Resultsmentioning

confidence: 97%

Evaluation of embedded IC approach for automotive application

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

Meier

Roellig

et al. 2013

Self Cite

Reliability assessment of discrete passive components embedded into PCB core

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and

Roellig

Osmolovskyi

et al. 2014

This paper will present the research results for reliability of two embedding technologies in comparison to the current standard - surface mount technology. The chosen embedding approaches utilize a cavity to place the necessary components into the PCB core. The difference is found in the way the component is connected to the PCB routing. For the first approach the circuit is first assembled on a carrier substrate using conventional surface mount technology (SMT). The solder paste is printed, the components are placed and the substrate board is soldered afterwards. The base substrate is then put together with prepared additional layers holding preformed cavities at the component locations. After another top layer has been added, the stack is finally laminated and the components are placed in the PCB core. The second approach is based on placing the components, then putting together the stack-up as described earlier and followed also with the laminating process. However the components have not been soldered. Instead an opening to the component's terminals is created through laservias. Then galvanic deposition is utilized to establish the connection to the PCB routing. For a comparison of the technologies samples with embedded resistors and ceramic capacitors in various sizes for the technologies as well as standard SMT have been prepared. To assess the reliability potential the samples have undergone temperature cycling tests. The testing is supported with FEM simulations which aided in the detection of critical design parameters and assess the residual manufacturing stress/strain states. The results of the investigations have shown that the damage mechanisms and predominant failure sites of the SMT & Cavity embedding variant is significantly different from conventional SMT. Here the resin material should be adopted to increase lifetimes even more. In the case of Microvia & Cavity the geometry of the microvia is essential towards the achievable reliability. Overall the results indicate the increased reliability potential of the novel approaches

Parameters of the manufacturing process and reliability of embedded components

Osmolovskyi

Proceedings of the 36th International Spring Seminar on Electronics Technology

Wolter

2013

The presented work deals with the reliability issues of embedded components in a PCB core. The process of the embedding technology is discussed in the course of this paper. We showed that the selection of manufacturing parameters strongly influences the quality of the embedding process and therefore the reliability of embedded systems. Results of the researches carried out at different values of decisive parameters are presented. We fabricated prototypes with embedded resistors and capacitors using the technology described in the article and tested them for their reliability. Additionally the effect of temperature and pressure during the manufacturing process on the electrical parameters of embedded components has been studied. As a result, we compared the reliability of PCBs produced by the embedding and the surface-mount technology and evaluated the impact of manufacturing faults on reliability