Reliability of ICA attachment of SMDs on inkjet-printed substrates

Niittynen, Juha; Kiilunen, Janne; Putaala, Jussi; Pekkanen, Ville; Mäntysalo, Matti; Jantunen, Heli; Lupo, Donald

doi:10.1016/j.microrel.2012.05.001

Cited by 29 publications

(13 citation statements)

References 14 publications

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“…34,35 Nowadays, high technical requirements in electronic modules are fulfilled with hybrid techniques, combining the advantages of the printing technologies with the traditional components of surface-mount technology (SMT). [36][37][38][39][40] The main issue related to this procedure is the surface-mount device (SMD) attachment onto inkjet patterned substrates. An usual material employed for SMT is reflow paste, 41 a sticky mixture of flux and solder particles, but it shows incompatibility with inkjet-printed pads.…”

Section: Introductionmentioning

confidence: 99%

“…Concerning this, solder particles on the reflow process were found to provoke a leaching effect by removing and damaging printed pads and generating undesired functional errors. 38 Recently, Niittynen et al implemented SMDs on inkjet-printed substrates by isotropically conductive adhesive (ICA) screen printing. 38 Moreover, Andersson et al assembled SMDs onto ink-jet printed paper with silver epoxy, solder, and conductive adhesive tapes.…”

Section: Introductionmentioning

confidence: 99%

“…38 Recently, Niittynen et al implemented SMDs on inkjet-printed substrates by isotropically conductive adhesive (ICA) screen printing. 38 Moreover, Andersson et al assembled SMDs onto ink-jet printed paper with silver epoxy, solder, and conductive adhesive tapes. 36,37 In this work, the recently patented use of silver nanoparticle-based inkjet ink (AgNP ink) as a new approach for assembling SMDs by means of high-resolution inkjet printing technology is presented.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Arrese

Vescio

Xuriguera

et al. 2017

Journal of Applied Physics

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Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature ($150 C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique. Published by AIP Publishing.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Arrese

Vescio

Xuriguera

et al. 2017

Journal of Applied Physics

View full text Add to dashboard Cite

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“…It is heavily dictated by customer demand, and the customers intensively demand smaller and lighter electronics devices with high cost-effectiveness [1]. To fulfill the demand, materials for the devices have to be supplied easily to lower cost manufacturing.…”

Section: Introductionmentioning

confidence: 99%

ITO nanoparticles reused from ITO scraps and their applications to sputtering target for transparent conductive electrode layer

Song

Song²,

Kim³

et al. 2017

Nano Convergence

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In this study, ITO nanoparticles (ITO-NPs) were reused from ITO target scraps to synthesize low cost ITO-NPs and to apply to make sputtering target for transparent conductive electrodes (TCEs). By controlling heat-treatment temperature as 980 °C, we achieved reused ITO-NPs having Brunauer, Emmett and Teller specific surface area (BET SSA) and average particle size 8.05 m2/g and 103.8 nm, respectively. The BET SSA decreases along with increasing heat-treatment temperature. The ITO-NPs were grown as round mound shape, and highly crystallized to (222) preferred orientations. Also, applying the reused ITO-NPs, we achieved an ITO target of which density was 99.6%. Using the ITO target, we achieved high quality TCE layer of which sheet resistance and optical transmittance at 550 nm were 29.5 Ω/sq. and 82.3%. Thus, it was confirmed that the reused ITO-NPs was feasible to sputtering target for TCEs layer.

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“…The customers strongly demand smaller and lighter devices with versatile functionality at a reasonable price [1,2]. With the strong demands, indium (In) has been used to fabricate indium tin oxide (ITO), a material for transparent conductive electrodes (TCEs) in electronic devices, owing to its unique high optical transparency and electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of indium-tin-oxide (ITO) nanoparticle ink-coated layers recycled from ITO scraps

Cha

Song

Lee³

2015

Journal of the Korean Physical Society

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This study investigates the characteristics of an indium-tin-oxide (ITO) ink layer that includes nanoparticles synthesized from ITO target scraps. The particle size of the ITO nanoparticle was less than 15 nm, and the crystal structure was cubic with a (222) preferred orientation. Also, the composition ratio of In to Sn was 92.7 to 7.3 in weight. The ITO nanoparticles were well dispersed in the ink solvent to formulate a 20-wt% ITO nanoparticle ink. Furthermore, the ITO nanoparticle ink was coated onto a glass substrate, followed by heat-treatment at 600 • C. The layer showed good sheet resistances below 400 Ω/ and optical transmittances higher than 88% at 550 nm. Thus, we can conclude that the characteristics of the layer make it highly applicable to a transparent conductive electrode.

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Reliability of ICA attachment of SMDs on inkjet-printed substrates

Cited by 29 publications

References 14 publications

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

ITO nanoparticles reused from ITO scraps and their applications to sputtering target for transparent conductive electrode layer

Characteristics of indium-tin-oxide (ITO) nanoparticle ink-coated layers recycled from ITO scraps

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