2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019
DOI: 10.1109/itherm.2019.8757226
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Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall1,
Vikas Yadav2,
Jeff Suhling3
et al.
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Cited by 5 publications
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References 30 publications
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Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

Li,
Li,
Wang
et al. 2024
Acta Metall. Sin. (Engl. Lett.)
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Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

Li,
Li,
Wang
et al. 2024
Acta Metall. Sin. (Engl. Lett.)
2
0
0
0
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Vibration at Low and Extreme Cold Temp for QFN Assembly Reliability

Ghaffarian
1
2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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High Temperature-Vibration Reliability of SnAgCu Leadfree Assemblies in Automotive Environments

Lall
1
,
Yadav
2
,
Suhling
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
3
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