Reliability Characterisation of Electrical and Electronic Systems 2015
DOI: 10.1016/b978-1-78242-221-1.00007-1
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Reliability of silicon integrated circuits

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Cited by 11 publications
(6 citation statements)
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“…The early phase of the dielectric breakdown is typically associated with the leakage current increase, characterized as "soft" breakdown. The later stage of the dielectric breakdown involves short failure, characterized as "hard" breakdown (Oates, 2015). Table I, the mechanism of the APD dielectric breakdown share some commonality with the ILD or gate dielectric breakdown in the integrated circuit (IC) transistor devices.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The early phase of the dielectric breakdown is typically associated with the leakage current increase, characterized as "soft" breakdown. The later stage of the dielectric breakdown involves short failure, characterized as "hard" breakdown (Oates, 2015). Table I, the mechanism of the APD dielectric breakdown share some commonality with the ILD or gate dielectric breakdown in the integrated circuit (IC) transistor devices.…”
Section: Resultsmentioning
confidence: 99%
“…Table I, the mechanism of the APD dielectric breakdown share some commonality with the ILD or gate dielectric breakdown in the integrated circuit (IC) transistor devices. For the ILD breakdown in the IC, the breakdown occurs along the interface between the low-k dielectric and its capping layer (Oates, 2015). Vol.…”
Section: Resultsmentioning
confidence: 99%
“…SEU and SET are considered "soft" errors and therefore mitigable, while SEL and SEB phenomena cause irreversible modifications of electronic structures. 333 For the radiation tolerance qualification of electronic components in space systems, two approaches are taken:…”
Section: Review Scitationorg/journal/rsimentioning
confidence: 99%
“…IC Insights projects that semiconductor R&D will rise by a 5.5% compound annual growth rate (CAGR) from 2018 through 2023, up from 3.6% during 2013(McGrath, 2019. To ensure product quality, experimental and modelling of reliability failure modes related to electromigration, stress migration, dielectric breakdown, hot carrier, soft error, and three-dimensional (3D) ICs have been extensively studied over the past few decades (Oates, 2015;McPherson, 2012;Hu, 2009;Tu, 2011).…”
Section: Introductionmentioning
confidence: 99%