Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Putaala, Jussi; Hannu, Jari; Kunnari, Esa; Mäntysalo, Matti; Nousiainen, Olli; Jantunen, Heli

doi:10.1016/j.microrel.2013.08.021

Cited by 16 publications

(8 citation statements)

References 12 publications

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“…This increase hints towards post-curing of the ink during the stress test. This phenomenon has been observed earlier [22].…”

Section: B Measurements and Reliability Test Resultssupporting

confidence: 79%

“…This can be seen in Figure 5b-c, where the average resistance values were reduced to approximately half of the initial average value during the execution of the whole test. This is in line with previous results [22]. Contrary to this, no such phenomenon was observed with the PI substrate.…”

Section: ) Ink Curing Temperaturessupporting

confidence: 93%

“…For example, by roughening the rather smooth substrate surface the ink would have adhered to it better. However, this result together with previous supporting results, and also noting the large moisture absorption of PI, [22,30] suggests that the use of this inksubstrate material combination is rather risky.…”

Section: ) Differences Between Substratesmentioning

confidence: 48%

“…Moisture absorption of polymer materials can cause problems in a field environment, as can elevated temperatures, which both in this case caused stresses in the interfaces of the different materials. Also, potential adhesion problems between the inkjet-printed, low-temperature curable silver conductors and substrates were of interest, as these issues have been noted earlier in stress tests with PI substrates and inkjet-printed silver conductors [22,31,32].…”

Section: Stress Testingmentioning

confidence: 95%

See 3 more Smart Citations

Capability Assessment of Inkjet Printing for Reliable RFID Applications

Putaala

Niittynen²,

Hannu

et al. 2017

IEEE Trans. Device Mater. Relib.

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In this paper, inkjet-printed silver traces and interconnections produced with the print-on-slope technique were used in an RFID structure operating in the UHF range. Underfill material was used to attach silicon RFID chips onto flexible, 125µm-thick polymer substrates. The cured underfill was also used as a sloped surface for printing interconnection traces from the chip to the plastic substrate's radiators. Inkjet printing was performed in one phase, producing both the interconnections to the chip and the radiators. This enables the use of a single-phase continuous roll-to-roll compatible process instead of the commonly used two-phase stop-and-go process. To further investigate the behavior of printed low-temperature nanoparticle ink and its compatibility with different substrate materials, basic conductive traces were printed onto the substrates. Thereafter, the structures were exposed to thermal/humidity tests at 85 °C temperature/85% relative humidity ("85/85") for up to a 2000-hour period. To gain an understanding of the response of the structures under stressing, the samples were intermittently characterized using a read range measurement device, followed by removal of failed samples from the test. The samples were characterized also by optical imaging and fieldemission scanning electron microscopy (FE-SEM). The bulk conductive traces were characterized electrically by measuring their resistances during test breaks. The results point out that, although some challenges are still to be overcome, inkjet printing is a feasible way of producing conductive traces for RFID structures, and that the print-on-slope technique is utilizable also in practical applications as a costeffective method with adequate reliability for producing interconnections between chip and substrate.

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“…This increase hints towards post-curing of the ink during the stress test. This phenomenon has been observed earlier [22].…”

Section: B Measurements and Reliability Test Resultssupporting

confidence: 79%

Section: ) Ink Curing Temperaturessupporting

confidence: 93%

Section: ) Differences Between Substratesmentioning

confidence: 48%

Section: Stress Testingmentioning

confidence: 95%

See 2 more Smart Citations

Capability Assessment of Inkjet Printing for Reliable RFID Applications

Putaala

Niittynen²,

Hannu

et al. 2017

IEEE Trans. Device Mater. Relib.

Self Cite

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show abstract

“…34,35 Nowadays, high technical requirements in electronic modules are fulfilled with hybrid techniques, combining the advantages of the printing technologies with the traditional components of surface-mount technology (SMT). [36][37][38][39][40] The main issue related to this procedure is the surface-mount device (SMD) attachment onto inkjet patterned substrates. An usual material employed for SMT is reflow paste, 41 a sticky mixture of flux and solder particles, but it shows incompatibility with inkjet-printed pads.…”

Section: Introductionmentioning

confidence: 99%

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Arrese

Vescio

Xuriguera

et al. 2017

Journal of Applied Physics

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Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature ($150 C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique. Published by AIP Publishing.

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Effect of Epoxy Conductive Adhesive on Film Deformation During the Thermoforming Process for In‐Mold Electronic Devices

Arias‐García,

Lozano‐Hernandez,

Ruldua

et al. 2024

Adv Materials Technologies

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In‐Mold Electronics (IME) is an innovative technology that allows the creation of 3D‐shaped electronic surfaces by combining printed electronics and In‐Mold Decoration (IMD). During the manufacturing process, the materials that integrate these devices, such as adhesive, must endure the transformation conditions of thermoforming. However, the adhesive rigidity may influence the deformation of the film during this process. In this study, both printed and hybridized samples are compared regarding their stretching and thickness reduction during the thermoforming process. The results indicate that the deformation of the hybridized samples differs from the printed ones, resulting in less stretching in areas near the adhesive, with stretching increasing as it steps away from where it is deposited. Thickness values are also affected, being greater around the adhesive and decreasing farther away. Therefore, the presence of the adhesive significantly impacts the behavior of the film during processing, a factor that must be considered in the design of IME devices to maximize the number of functional devices.

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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Cited by 16 publications

References 12 publications

Capability Assessment of Inkjet Printing for Reliable RFID Applications

Capability Assessment of Inkjet Printing for Reliable RFID Applications

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Effect of Epoxy Conductive Adhesive on Film Deformation During the Thermoforming Process for In‐Mold Electronic Devices

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