Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

Salahouelhadj, Abdellah; Martiny, Marion; Mercier, Sébastien; Bodin, Laurent; Manteigas, David; Stephan, Bendik Johnsen

doi:10.1016/j.microrel.2013.08.005

Cited by 28 publications

(16 citation statements)

References 16 publications

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“…Moreover, studies and reviews published 20 years ago focused on the influence of the material composition, manufacturing process, and design parameters on the reliability of plated through holes in multi-layer PCBs [6,7,8]. This problem remains unsolved even today [9,10]. In recent studies, the temperature stabilities of plated through holes, buried holes, and microvias used to interconnect various PCB layers have been examined.…”

Section: Introductionmentioning

confidence: 99%

“…In recent studies, the temperature stabilities of plated through holes, buried holes, and microvias used to interconnect various PCB layers have been examined. Salahouelhadj et al [9] conducted experimental and theoretical study of the Cu plating thickness, hole diameter, and PCB thickness on reliability. The obtained results confirmed that the difference in CTE along the z-axis of the material was a key parameter for reliability analysis.…”

Section: Introductionmentioning

confidence: 99%

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Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Rudajevová

Dusek

2018

Materials

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Irreversible dimension changes of an FR4 laminate board in the z-direction and FR4 laminate/Cu plated holes that depend on their manufacturing histories have been studied by thermal mechanical analysis in the temperature range from room temperature to 240 °C. It is found that the compression residual stresses generated in both materials due to manufacturing pressing are released during heating, leading to an elongation in the specified direction. This increase depends on the composition of the studied composite and number of pressing cycles. The second reason for the observed dimensional changes is insufficient curing during manufacture that causes post-curing after the first heating cycle and related board shrinkage in the z-direction. The temperature regions of these two processes are not the same. The post-curing process occurs in the transition temperature range (near the glass transition temperature), whereas the release of the compression residual stress is observed at higher temperatures. Both these processes are temperature-dependent and do not proceed to completion during one heating cycle. Moreover, the compression residual stress strongly influences the post-curing process.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Rudajevová

Dusek

2018

Materials

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“…Some authors [2], [3], [4], [5], [6], [7] address this subject to evaluate the reliability of PTHs by the mean of finite element simulations. In [3], [4], [5], [6], the fatigue behavior of electrodeposited copper was studied by submitting PTHs to thermal loadings. But this method does not permit direct strain measurements and the link between strain and failure has to be carried out through the numerical simulation of a PCB.…”

Section: Introductionmentioning

confidence: 99%

“…The mechanical behavior of copper in PTH studies is often considered as elastic perfectly plastic, or is identified based on a tensile rtest [2], [4]. Some studies have conducted tests on copper films [8], [9], [5], [10], [11] but none of them during cycles. However, copper exhibits kinematic hardening.…”

Section: Introductionmentioning

confidence: 99%

Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

Girard¹,

Martiny²,

Mercier³

2020

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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In operation, a Printed Circuit Board (PCB) will face various and repeated thermomechanical loadings that may lead to the failure of the copper, and thus to the malfunction of the PCB itself. In order to simulate and better predict the reliability of PCBs, the constitutive behavior of copper has to be defined. In the present work, a 17 µm rolled annealed copper film frequently used in the flexible PCB industry has been tested under a cyclic tensile-compressive loading. The copper has a low elastic limit and plastic deformation plays thus an important role during straining. Under cyclic loadings, a predominant kinematic hardening has been observed. The plastic behavior of the studied copper film has been identified with a Lemaitre-Chaboche hardening model. Next, an original experimental setup has been developed, allowing to measure the fatigue behavior of thin copper films under cyclic loadings. Tests with various loading amplitudes are carried out. A Coffin-Manson model has been adopted to reproduce the experimental data.

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“…In order to anticipate reliability problems in PCBs, the use of simulation is a necessity, allowing thus to work around the design strategy and avoiding the definition of several unsuccessful prototypes. By simulating different con-figurations, it is possible to determine the most reliable design and thus improve the fatigue life of the PCB [2,3,4,5,6].…”

Section: Introductionmentioning

confidence: 99%

Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

Girard

Jrad

Bahi

et al. 2018

Composite Structures

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The elastic orthotropic behavior of thin woven composites is studied combining a numerical and experimental strategy. For thin materials, in-plane properties are measured by classical tensile tests and digital image correlation. The out-of-plane properties are derived performing finite element simulations at the level of the internal structure of the laminate. Indeed, the glass fiber arrangement in the yarn and the weaving pattern are defined based on microtomography and SEM observations. So a representative unit cell is found. A statistical approach is further proposed to derive the behavior of the warp and fill yarns, since the fiber position may fluctuate between yarns. For the considered laminate, the matrix (resin and ceramic inclusion) behavior is unknown and difficult to measure. Therefore an inverse method is proposed. By comparing with measured in-plane elastic moduli, behaviors of the matrix, of yarns and of the laminate are defined. The present homogenization strategy is exemplified by laminates used in printed circuit boards for high frequency applications. This approach has also been applied to investigate the evolution of the elastic moduli of the laminate with temperature. Those information, usually not available in the literature, are important when dealing with reliability of printed circuit boards during thermal cycles.

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Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

Cited by 28 publications

References 16 publications

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

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