Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly

Sivakumar, M.; Kripesh, V.; Choong, Chong Ser; Chong, Chai Tai; Lim, Loon Aik

doi:10.1016/s0026-2714(02)00185-3

Cited by 13 publications

(4 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As a major cost reduction trend of the plastic based electronic packaging, the copper wire bonding technology is widely adopted by the manufactures [ 2 ], in order to replace the gold wire bonding technology. As a consequence, new failure modes occur during the process and long-term lifetime, mainly due to that the copper exhibits different material characteristics than gold, such as mechanical stiffness and the growth rate of intermetallic compound (IMC).…”

Section: Introductionmentioning

confidence: 99%

FE modeling of Cu wire bond process and reliability

Yuan

Weltevreden

Akker

et al. 2011

2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem

View full text Add to dashboard Cite

Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the interface of wire and bond pad. This paper will present the finite element analysis of the copper wire bond process and IMC forming and results in the stress pattern shift during the processes.

show abstract

Section: Introductionmentioning

confidence: 99%

FE modeling of Cu wire bond process and reliability

Yuan

Weltevreden

Akker

et al. 2011

2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem

View full text Add to dashboard Cite

show abstract

“…The most commonly used process is wire bonding by metallization [ e.g ., electroplating, chemical plating, physical vapor deposition (PVD), chemical vapor deposition (CVD), and a radio frequency (RF) sputtering method, etc.) to achieve stable connection in the electronic package 12–14. The Cu electroplating for wire bonding presents several advantages, including significant cost saving, higher electrical and thermal conductivity, weaker electromagnetic effect, and superior mechanical properties, importantly, it could effectively avoid the leading‐in stress and decrease the influence of stress anisotropy on impedance 10, 15.…”

Section: Introductionmentioning

confidence: 99%

Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co‐based amorphous wires

Liu¹,

Sun²,

Xing³

et al. 2010

Physica Status Solidi (a)

View full text Add to dashboard Cite

In order to study the effect of wire bonding by Cu electroplating on giant magneto‐impedance (GMI) stability of microwires for potential sensor application. The electroplated microstructure was observed by scanning electron microscopy (SEM) and GMI was studied by a precision impedance analyzer placed in a magnetically shielded space. Experimental results indicated that after electroplating at a current intensity of 395.0 A/dm2 holding for 60 s with a two‐terminal electroplated length of 4 mm of the microwire, the Cu layer with a homogeneous and compact granular structure has higher adhesive strength between the wire and the Cu layer, better wettability between wire and SAC, lower contact resistance and coefficient of thermal expansion (CTE). Consequently, the wire bonding by Cu electroplating could enhance the conductivity and impedance stability under different applied field. It can, therefore, be concluded that the wire bonding by a Cu electroplating technique is suitable for electronic packaging for sensor applications.

show abstract

“…The currently used wire is gold with a typical diameter of about 30 mm. According to the technology roadmap, the thickness will be reduced to beyond 15 mm, and copper may replace gold for many applications (Sivakumar et al, 2002). These changes generate extra challenges for the prediction and prevention of wire bond failures.…”

Section: Introductionmentioning

confidence: 99%

Reliability of wirebonds in micro‐electronic packages

Driel

Silfhout²,

Zhang³

2008

Microelectronics International

View full text Add to dashboard Cite

Purpose -At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire bond-related failures are becoming increasingly important. This paper aims to understand these kinds of failures. Design/methodology/approach -Different finite element (FE) techniques are explored to their ability to describe the thermo-mechanical behavior of the wire embedded in the electronic package. The developed nonlinear and parametric FE models are able to predict the strong nonlinear behavior of wire failures and multi-failure mode interaction accurately and efficiently. Findings -It is found that both processing and testing environments as well as the occurrence of delamination strongly increase the risk for wire failures. The results indicate that processing and testing influences are much less than those of the delamination. Practical implications -Package designers should focus on limiting the occurrence of delamination around wire bond and/or stitch areas. Originality/value -Combining the strengths of predictive modeling with simulation-based optimization methods, the optimal wire shape is obtained.

show abstract

Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly

Cited by 13 publications

References 0 publications

FE modeling of Cu wire bond process and reliability

FE modeling of Cu wire bond process and reliability

Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co‐based amorphous wires

Reliability of wirebonds in micro‐electronic packages

Contact Info

Product

Resources

About