Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology

Zeng, Zheng; Ou, Kaihong; Wang, Liang; Yu, Yue

doi:10.1109/tdmr.2020.3012065

Cited by 16 publications

(6 citation statements)

References 43 publications

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“…The material cost of the dual-sided package is also comparable to the single-sided with the same number of die due the small size of the packages and the fact that the SiC devices are the cost driving factor with respect to materials. The dual-sided package may be superior in terms of thermal performance, but it has yet to be universally adopted due to a lack of understanding of its thermo-mechanical lifetime and due to the high cost of manufacturing [21,11]. Incorporating PCM into a single-sided package may be a viable alternative to improving PE reliability and thermal performance without incurring the high cost of manufacturing dual-sided packages.…”

Section: Us06 Drive Cycle Results With Erythritol-copper Pcmmentioning

confidence: 99%

“…Power electronics control the flow of power between the battery and the traction motor, and account for 7-15% of the overall cost of an electric vehicle [11]. or accelerator pedals, the electronic controller sends control signals to the power electronics, which regulates the power flow and converts DC power from the batteries to AC power for the motor [12].…”

Section: Power Electronic Packagingmentioning

confidence: 99%

“…The use of sided cooling may allow for air to be used as a working fluid, eliminating the need for a dedicated coolant loop, dramatically reducing the size and weight of the system [20]. Despite the numerous benefits of dual-sided packaging, it has not been universally adopted commercially due to the lack of design methodology, the high cost of production, unsolved thermo-mechanical models, and a lack of understanding of the package lifespan [11,21]. High temperature packaging, as well as novel approaches to packaging architecture, have both been recognized as areas that need to be further developed, so that the benefits of SiC devices can be fully realized [22].…”

Section: Power Electronic Packagingmentioning

confidence: 99%

“…where Nu is the Nusselt number, Dh is the hydraulic diameter of the cold plate channels, and k is the thermal conductivity of the working fluid. Churchill correlations [20] were used to solve for the friction factor, and Nusselt number, and are described in Equations (10)(11)(12)(13)(14). Equation (10) describes the overall Nusselt number:…”

Section: Heat Transfer Coefficientmentioning

confidence: 99%

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Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Hollis

Sharar

Bandhauer

2021

Journal of Electronic Packaging

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High temperature silicon carbide (SiC) die are the most critical and expensive component in electric vehicle (EV) power electronic packages and require both active and passive methods to dissipate heat during transient operation. The use of phase change materials (PCMs) to control the peak junction temperature of the SiC die and to buffer the temperature fluctuations in the package during simulated operation is modeled here. The latent heat storage potential of multiple PCM and PCM composites are explored in both single-sided and dual-sided package configurations. The results of this study show that the addition of phase change material (PCM) into two different styles of power electronics (PE) packages is an effective method for controlling the transient junction temperatures experienced during two different drive cycles. The addition of PCM in a single-sided package also serves to decrease temperature fluctuations experienced and may be used to reduce the necessary number of SiC die required for EVs, lowering the overall material cost and volume of the package by over 50%. PCM in a single-sided package may be nearly as effective as the double-sided cooling approach of a dual-sided package in the reduction of both peak junction temperature of SiC as well as controlling temperature variations between package layers.

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Section: Us06 Drive Cycle Results With Erythritol-copper Pcmmentioning

confidence: 99%

Section: Power Electronic Packagingmentioning

confidence: 99%

Section: Power Electronic Packagingmentioning

confidence: 99%

Section: Heat Transfer Coefficientmentioning

confidence: 99%

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Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Hollis

Sharar

Bandhauer

2021

Journal of Electronic Packaging

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“…Power loss includes two parts: conduction loss and switching loss. Switching losses are closely related to the stray parameters of the module packaging [20]. Meanwhile, MOSFET on-state losses are mainly caused by the device's on-state resistance, which is a function of temperature.…”

Section: Coupling Relationship Between Thermal Field and Electric Fieldmentioning

confidence: 99%

Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation

Wang

Ding

et al. 2022

Energies

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With the development of power modules for high voltage, high temperature, and high power density, their size is becoming smaller, and the packaging insulation experiences higher electrical, thermal, and mechanical stress. Packaging insulation needs to meet the requirement that internal electric field, temperature, and mechanical stress should be as low as possible. Focusing on the coupling principles and optimization design among electrical, thermal, and mechanical stresses in the power module packaging insulation, a multi-objective optimization design method based on Spice circuit, finite element field numerical calculation, and multi-objective gray wolf optimizer (MOGWO) is proposed. The packaging insulation optimal design of a 1.2 kV SiC MOSFET half-bridge power module is presented. First, the high field conductivity characteristics of the substrate ceramic and encapsulation silicone of the packaging insulation material were tested at different temperatures and external field strengths, which provided the key insulation parameters for the calculation of electric field distribution. Secondly, according to the mutual coupling principles among electric–thermal–mechanical stress, the influence of packaging structure parameters on the electric field, temperature, and mechanical stress distribution of packaging insulation was studied by finite element calculation and combined with Spice circuit analysis. Finally, the MOGWO algorithm was used to optimize the electric field, temperature, and mechanical stress in the packaging insulation. The optimal structural parameters of the power module were used to fabricate the corresponding SiC MOSFET module. The fabricated module is compared with a commercial module by the double-pulse experiment and partial discharge experiment to verify the feasibility of the proposed design method.

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An Optimization Design Method of Multi-chip Parallel Power Module Based on Machine Learning

Wang,

Huang,

et al. 2023

Lecture Notes in Electrical Engineering

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Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology

Cited by 16 publications

References 43 publications

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation

An Optimization Design Method of Multi-chip Parallel Power Module Based on Machine Learning

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