Reliability oriented design of power supplies for high energy physics applications

Baccaro, S.; Busatto, G.; Citterio, M.; Cova, Paolo; Delmonte, Nicola; Iannuzzo, Francesco; Lanza, A.; Riva, M.; Sanseverino, Annunziata; Spiazzi, G.

doi:10.1016/j.microrel.2012.06.088

Cited by 12 publications

(6 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In order to tune the convective heat transfer coefficient h in the model within the range of variability, a thermal characterization was performed on the prototype at thermal steady state and known operating conditions (Tab. 1), by means of an infrared (IR) camera and thermocouples (for more details about the tuning procedure, see [14]). Input and output power were measured by power meters and the dissipated power on every die was estimated by SPICE simulations.…”

Section: Fe Thermal Model Tuningmentioning

confidence: 99%

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cova

Delmonte

Solomon

et al. 2016

Microelectronics Reliability

Self Cite

View full text Add to dashboard Cite

(2016) Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability. Microelectronics Reliability, 64 . pp. 507-512. ISSN 0026-2714 Access from the University of Nottingham repository: http://eprints.nottingham.ac.uk/43872/1/Thermal%20design%20optimization%20of%20novel %20modular%20power%20converter%20assembly%20enabling%20higher%20performance %20reliability%20and%20availability.pdf The version presented here may differ from the published version or from the version of record. If you wish to cite this item you are advised to consult the publisher's version. Please see the repository url above for details on accessing the published version and note that access may require a subscription. AbstractAn alternative integration scheme for a half-bridge switch using 70 m thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Such a novel assembly approach is suitable to optimize performance, reliability and availability of the power system in which it is used. The paper focuses on the thermal performance of this assembly at normal and extreme operating conditions, studied by means of FEM thermofluidynamic simulations of the module integrated with connectors and liquid cooler, and thermal measurement performed on an early prototype. Improved solutions are also investigated by the FE model.

show abstract

Section: Fe Thermal Model Tuningmentioning

confidence: 99%

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cova

Delmonte

Solomon

et al. 2016

Microelectronics Reliability

Self Cite

View full text Add to dashboard Cite

show abstract

“…In table 1 the main features of the MC have been detailed. Further details about the MC can be found in literature [9,[11][12][13][14][15][16].…”

Section: The Power Convertermentioning

confidence: 99%

Developments on DC/DC converters for the LHC experiment upgrades

et al. 2014

View full text Add to dashboard Cite

“…At the board level, Point of Load (PoL) converters should be implemented on Front-end Boards (FEBs) for precise voltage adaptation and regulation as depicted in Figure 1 [10]. The MC is designed starting by a modular approach in order to improve the overall reliability of the system and provide the requested redundancy as well described in the following Section III.…”

Section: The Power Distribution and The Main Convertermentioning

confidence: 99%

Thermal modeling and characterization for designing reliable power converters for LHC power supplies

et al. 2014

View full text Add to dashboard Cite

Power supplies for LHC experiments (ATLAS) require DC-DC power converters able to work in very hostile environments. The APOLLO collaboration, funded by the Italian Istituto Nazionale di Fisica Nucleare (INFN), aims to study dedicated topologies and to design, build and test demonstrators, developing the needed technology for the industrialization phase.Besides the presence of radiation and magnetic fields, thermal specifications are particularly stringent in the working environment. In order to have the wanted features in terms of reliability and availability during the experimental activity, these power electronics circuits must be cooled by specifically designed water heat sinks, and an accurate thermal design is mandatory in order to guarantee safe and reliable operation. Moreover, an optimized thermal design allows to have a maintenance strategy in compliance with the requirements of the experiments.In this paper thermal characterization is used for tuning a coupled thermo-fluid-dynamic 3D numerical model, for both the water heat sink and the whole system. Based on this model an optimized water heat sink was designed and fabricated. Thermal characterization of the power converter demonstrator in different operating conditions shows good agreement with simulation results.

show abstract

Reliability oriented design of power supplies for high energy physics applications

Cited by 12 publications

References 5 publications

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Developments on DC/DC converters for the LHC experiment upgrades

Thermal modeling and characterization for designing reliable power converters for LHC power supplies

Contact Info

Product

Resources

About