2015
DOI: 10.1109/tpel.2014.2361918
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Reliability Oriented Design Tool For the New Generation of Grid Connected PV-Inverters

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Cited by 121 publications
(55 citation statements)
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“…Several works based on the PoF approach have proved that the major failure mechanisms of power semiconductors in power modules are closely related to the thermal stress [10]- [12]. More precisely, the thermal cycling caused by power variations in a mission profile leads to accumulated fatigue, causing major failures such as the bond wire liftoff.…”
Section: Thermally Compensated Discontinuous Modulation Strategy For mentioning
confidence: 99%
“…Several works based on the PoF approach have proved that the major failure mechanisms of power semiconductors in power modules are closely related to the thermal stress [10]- [12]. More precisely, the thermal cycling caused by power variations in a mission profile leads to accumulated fatigue, causing major failures such as the bond wire liftoff.…”
Section: Thermally Compensated Discontinuous Modulation Strategy For mentioning
confidence: 99%
“…Where L0 is the device normal lifetime, CREE states that the life time of 1х107 hours can be achieved for the current SiC devices [18]; B=(Ea/KB), Ea is the activation energy which is equal to 0.06606 eV [19], KB is Boltzman's constant; ΔTj is the variation of semiconductor junction temperature and can be calculated as:…”
Section: Reliabilty Calculationmentioning
confidence: 99%
“…The literature based on the physics of failure approach has claimed that the reliability is closely associated with the thermal stress, consequent with the power profile [11], [12]. According to a commonly applied lifetime model, the failures occur when the accumulated thermal stress exceeds the device's strength [12].…”
Section: Introductionmentioning
confidence: 99%