2014
DOI: 10.1166/jom.2014.1047
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Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging

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Cited by 2 publications
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“…Figure 12 shows the cross-polarized image of 10 mm SAC105 solder balls, the crack which might be effect by grain boundaries. This is due to the formation of a continuous network of high-angle (grain) boundaries by local recrystallization increasing grain structure movement along the interfacial region, enhancing cracks nucleation and propagation through the recrystallized solder interconnections [ 23 , 24 ].…”
Section: Resultsmentioning
confidence: 99%
“…Figure 12 shows the cross-polarized image of 10 mm SAC105 solder balls, the crack which might be effect by grain boundaries. This is due to the formation of a continuous network of high-angle (grain) boundaries by local recrystallization increasing grain structure movement along the interfacial region, enhancing cracks nucleation and propagation through the recrystallized solder interconnections [ 23 , 24 ].…”
Section: Resultsmentioning
confidence: 99%