Reliability of High-Power Mechatronic Systems 2 2017
DOI: 10.1016/b978-1-78548-261-8.50008-5
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Reliability Study of High-Power Mechatronic Components by Spectral Photoemission Microscopy

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Cited by 7 publications
(7 citation statements)
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“…The TEG tile is built up by p-n junction which is connected in series one to each other, [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]23]. The TEG tile used in this paper has dimensions as depicted by figure 7:…”
Section: Methodsmentioning
confidence: 99%
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“…The TEG tile is built up by p-n junction which is connected in series one to each other, [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]23]. The TEG tile used in this paper has dimensions as depicted by figure 7:…”
Section: Methodsmentioning
confidence: 99%
“…The equation (22) states a no rotational field is obtained for which a scalar potential function is admitted to developing the equation (23):…”
Section: ( )ˆ( ) mentioning
confidence: 99%
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“…The Seebeck voltage, V, is described by Eq. (1) (Moultif et al 2017), which shows that Seebeck voltage is dependent upon dissimilar conductor materials combination used and the temperature gradient between the sensing junction and reference junction (Sutter et al 2003). Hence, highly repeatable temperature measurement thermocouples are constructed in this way.…”
Section: Thermocouples Work Principle Of the Thermocouplesmentioning
confidence: 99%