Reliability test procedures for achieving highly robust electronic products

Tekcan, Tarkan; Kirisken, Barbaros

doi:10.1109/rams.2010.5447982

Cited by 7 publications

(3 citation statements)

References 1 publication

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“…The proposed new IC with smaller power part passed all standard product validation tests [11]. Measured onresistance of the original power MOSFET with finger gates was 397.53 m and measured resistance of the waffle MOSFET was 397.92 m.…”

Section: Waffle Mosfet Implementation In Power Integrated Circuitsmentioning

confidence: 99%

Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance

Barri¹,

Kote²,

Vacula³

et al. 2019

RADIOENGINEERING

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This article describes waffle power MOSFET segmentation and defines its analytic models. Although waffle gate pattern is well-known architecture for effective channel scaling without requirements on process modification, until today no precise model considering segmentation of MOSFETs with waffle gate patterns, due to bulk connections, has been proposed. Two different MOSFET topologies with gate waffle patterns have been investigated and compared with the same on-resistance of a standard MOSFET with finger gate pattern. The first one with diagonal metal interconnections allows reaching more than 40% area reduction. The second MOSFET with the simpler orthogonal metal interconnections allows saving more than 20% area. Moreover, new models defining conditions where segmented power MOSFETs with waffle gate patterns occupy less area than the standard MOSFET with finger gate pattern, have been introduced.

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Section: Waffle Mosfet Implementation In Power Integrated Circuitsmentioning

confidence: 99%

Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance

Barri¹,

Kote²,

Vacula³

et al. 2019

RADIOENGINEERING

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“…The only way to evaluate the effectiveness of accelerating tests is the observation of the actual frequency of failures and returns from the field. Tekcan and Kirisen [27] mentioned the importance of feedback from field returns, but didn't deepen their centrality for reliability design. Hence the value of integrating inside reliability growth programs a process of historical data analysis coming from components (or products) similar to the new one under analysis, also considering the operating environment, mode and intensity of use.…”

Section: A Novel Approach For Complex Products Reliability Growth And...mentioning

confidence: 99%

Tailoring HALT/HASS Tests towards Product Reliability Growth and Cost Saving

Mancusi,

Romaniello,

Fruggiero

et al. 2023

10th Manufacturing Engineering Society International Conference (MESIC 2023)

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The growing competitiveness of the manufacturing market and the increasingly strict reliability standards are raising up the adoption of highly accelerating tests HALT and HASS in the engineering stage of a new product. A reliability growth program primarily benefits the manufacturer, who will be able to plan with greater confidence the optimal warranty and the product performance during its useful life. However, there is actually a divergence between design reliability and field reliability. Furthermore, the energy consumption caused by the highly accelerating tests represents a significant cost both economically and environmentally. In this work we are proposing the tailoring of HALT and HASS as a solution for both reliability growth and energy saving. The approach points on data collected from Hitachi Rail. Discussion and results, even though in a methodological and probabilistic map, confirmed the convenience of tailored test over personalized usage.

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“…Some common reasons for failures in electronics are environmental contaminants and conditions such as temperature and humidity, along with other failures derived from vibration, ripple voltage, and overvoltage. These all affect the overall reliability of electronic components (Tekcan and Kirisken, 2010).…”

Section: Introductionmentioning

confidence: 99%

Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors

Virkki

Sydänheimo

Raumonen

2011

Soldering &Amp; Surface Mount Technology

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PurposeAccelerated tests are commonly used to evaluate the reliability of electronic components and to detect failures caused by environmental conditions in field use. Many standard accelerated tests are available for evaluating the reliability in a commonly approved way. These tests form a good basis for reliability testing. However, sometimes standard accelerated tests may not be directly used to test the reliability of a certain component. Rather, such tests should be modified for each component, based on the component's structure and field use. The purpose of this paper was to modify two Joint Electron Device Engineering Council (JEDEC) standard accelerated tests: the steady‐state temperature humidity‐bias life test (the 85/85 test) and the temperature cycling test, for use in testing tantalum capacitors more efficiently.Design/methodology/approachThe 85/85 test was first modified by adding a ripple voltage and then by adding a voltage off‐period. The temperature cycling test was modified by using applied voltage during the test and then by shortening the testing time.FindingsStandard accelerated tests form a good basis for reliability testing, but accelerated tests should be carefully planned and tailored for each component type, based on structure and conditions of use. Results show that, with minor modifications, standard tests can be diversified into various types of tests.Research limitations/implicationsConclusions are mostly based on a literature review. More testing needs be undertaken in order to collect statistical data to validate the conclusions.Originality/valueThe objective in this paper was to produce more versatile tests for tantalum capacitors, based on two JEDEC standard accelerated tests. The developed tests can help detect failure mechanisms of tantalum capacitors faster and more accurately than standard accelerated tests.

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Reliability test procedures for achieving highly robust electronic products

Cited by 7 publications

References 1 publication

Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance

Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance

Tailoring HALT/HASS Tests towards Product Reliability Growth and Cost Saving

Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors

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