2015
DOI: 10.1109/temc.2015.2427377
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Removable EBG-Based Common-Mode Filter for High-Speed Signaling: Experimental Validation of Prototype Design

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Cited by 25 publications
(5 citation statements)
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“…However, the differential transmission characteristics are not estimated before performing full-wave simulations and measurements. As reported in References [8][9][10][11], a stepped impedance resonator is favorable for MTM-DTLs. In Reference [8], a stepped impedance resonator is implemented using various sizes for planar patches.…”
Section: Introductionmentioning
confidence: 87%
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“…However, the differential transmission characteristics are not estimated before performing full-wave simulations and measurements. As reported in References [8][9][10][11], a stepped impedance resonator is favorable for MTM-DTLs. In Reference [8], a stepped impedance resonator is implemented using various sizes for planar patches.…”
Section: Introductionmentioning
confidence: 87%
“…As reported in References [8][9][10][11], a stepped impedance resonator is favorable for MTM-DTLs. In Reference [8], a stepped impedance resonator is implemented using various sizes for planar patches. A large patch and a narrow branch correspond to low and high characteristic impedances, respectively.…”
Section: Introductionmentioning
confidence: 87%
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“…Traditional EBG structure of mushroom and planar EBG are implemented for the suppression of common-mode noise of differential signals in [12] and [13], respectively. Literature [15] has reported a removable CMF based on EBG. Nevertheless, EBG filter is limited in applications because it usually cannot realize a wideband common-mode noise reduction.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, many research studies have been made to improve harmonic suppression and reduce circuit size, including periodic triangular corrugations lines (Das and Chatterjee, 2017), GaAs MMIC tunable active filter or varactor tuned dielectric resonator filter (Tang et al, 2016;Pantoli et al, 2017;Kamoun et al, 2013;Fengxi and Mansour, 2014), multi-layers low temperature co-fired ceramic or printed circuit board (PCB) substrates (Tang, 2004;Leung et al, 2002;Kim et al, 2017;Rong et al, 1999;Shaman et al, 2014), band pass filter (BPF) cascaded with a low-pass (Yousefi et al, 2016), periodic grooved on microstrip (Kuo et al, 2002;Srisathit et al, 2011), defected ground structure or co-plane waveguide filters (Sun et al, 2010;Kong et al, 2016;Cadiou et al, 2014;Varner et al, 2015;Feng et al, 2016;Mondal et al, 2016), multilayer substrate integrated waveguide filter (Kong et al, 2016;Cadiou et al, 2014), fractal-shaped microstrip (Lotfi-Neyestanak and Lalbakhsh, 2012;Hsu et al, 2013), etc. However, many filters have big size, which limits their integration into MMIC working in microwave/MMW.…”
Section: Introductionmentioning
confidence: 99%