Removal of 10-nm contaminant particles from Si wafers using argon bullet particles

Hwang, Kyu Ho; Lee, Ki-hyun; Kim, Inho; Lee, Jinwon

doi:10.1007/s11051-011-0479-8

Cited by 10 publications

(1 citation statement)

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“…This cleaning technique might be less influenced by a boundary layer and has been improved by tuning the bullet particle size to the nanometer range and applying supersonic particle velocities. 7,49 A cleaning technique in which a boundary layer is completely eliminated is 'freeze cleaning', whereby a cleaning solution is frozen and it is claimed that volumetric expansion is used to remove particles. 50 But also in the latter cases, the cleaning procedure needs to be further optimized to avoid damage creation to fragile device elements.…”

Section: Future Outlookmentioning

confidence: 99%

Nanoparticle Removal with Megasonics: A Review

Brems

Hauptmann

Camerotto

et al. 2013

ECS J. Solid State Sci. Technol.

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Nanoparticle removal obtained without inflicting damage to fragile device elements remains a big challenge. The feasibility of physical cleans is assessed and boundary conditions are outlined. An overview of megasonic cleaning process improvements is given. In order to reduce damage without reducing particle removal frequencies during high frequency ultrasound cleaning processes, cavitation needs to be better controlled. This is partly achieved by (1) using pulsed acoustic fields which makes it possible to control the average bubble size and, at the same time, maximize the number of resonant bubbles, by (2) increasing the dissolved gas concentration and lowering the surface tension which facilitates bubble formation and, finally, by (3) introducing traveling waves to transport bubbles to the surface which needs to be cleaned.

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Section: Future Outlookmentioning

confidence: 99%