Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces

Abstract

Engineering the surface orientation of face-centered cubic (fcc) metals to the close-packed {111} plane can significantly enhance their oxidation resistance. However, owing to the synergetic effect of surface energy density (γ˙) and strain energy density (ω), such close-packed surface orientation can currently only be achieved by atomic-level thin film epitaxy or monocrystallization of polycrystalline metals. In this study, we characterized the microstructures of pure copper (Cu) foil and two types of graphene-coated Cu (Gr/Cu) foils and observed a 12~14 nm thick reconstructed surface layer with the {111} orientation in the high-temperature deposited Gr/{001} Cu surface. Combining the statistical results with thermodynamic analysis, we proposed a surface melting-solidification mechanism for the reconstruction of the Cu surface from {001} orientation to {111} orientation. This process is dominated by Gr/Cu interfacial energy and is particularly promoted by high-temperature surface melting. We also validated such a mechanism by examining Cu surfaces coated by h-BN (hexagonal boron nitride) and amorphous carbon. Our findings suggest a possible strategy to enhance the surface properties of fcc metals via engineering surface crystallography.

Crystallography and Applications of Metallic Materials

“…In this work, various aspects were considered, such as dislocations, their motion, the influence of sub-grain boundaries, crystalline misorientations in polycrystalline materials and the crystallographic texture. The second work analyzed the reorientation mechanisms of a specific material (graphene coated copper) on {001} surfaces Contribution (2). In this case, a meltingsolidification mechanism was proposed to understand the formation mechanism of the surface reconstruction.…”

Effect of Copper Surface Roughness on the High-Temperature Structural Stability of Single-Layer-Graphene

“…It is important to prepare Gr-coated metal samples with similar Gr structures and different metal surface roughness. Recent studies [42][43][44] have demonstrated that high-temperature annealing of the Gr/Cu bilayer can tailor the height and density of surface steps and is ultimately reflected in the average surface roughness (Ra) of Cu. In addition, in order to exclude the effect of Gr layer number, single-layer graphene (SLG) was chosen as the model Gr material.…”

Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States

“…As the bridge that connects heterophases of composites, interface and its related characteristics to a large extent play a decisive role in determining comprehensive properties. , Interface characteristics include but not limited to defects at or near the interface, interface orientation, interface strain, interface roughness, interface chemical components, and interfacial bonding. Among them, interfacial bonding is particularly critical because it directly influences interfacial loading transfer, , interface energy carriers’ scattering and coupling, , and interface oxidation and corrosion behaviors. , In addition, other characteristics also intrinsically influence interfacial bonding.…”