Requirements for AMHS in 450 mm era

Kondo, Hiroshi

doi:10.1109/issm.2006.4493057

Cited by 3 publications

(1 citation statement)

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“…Smaller lot sizes and increased setup frequency are anticipated in 450 mm wafer fabs. In particular, lot sizes of 3, 5 and 10 wafers have been recommended and/or discussed in (Pettinato and Pillai 2005) and (Kondo 2006).…”

Section: Introductionmentioning

confidence: 99%

On the fidelity of the Ax+B equipment model for clustered photolithography scanners in fab-level simulation

Morrison

2011

Proceedings of the 2011 Winter Simulation Conference (WSC)

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Linear and affine (Ax + B) models are commonly used to model equipment throughput in semiconductor wafer fabricator simulations. We endeavor to assess the quality of such models for the prohibitively expensive clustered photolithography scanner. The simulations demonstrate that such models are of varying quality. They can exhibit significant deviation from the system behavior when the simulation parameters, such as product mix and wafers per lot, change from those used to create the models. The error in throughput can range from about 4% to 60% as the number of wafers per lot varies from 24 to 1. These errors are of particular relevance for studies that consider a change to small lot sizes and high mix, as is predicted in the 450 mm era.

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Section: Introductionmentioning

confidence: 99%