Research and prospect of binary high-temperature Pb-free solders

Abstract

2015),"Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints", Soldering & Surface Mount Technology, Vol. 27 Iss 1 pp. 45-51 http:// dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high temperature Sn-Pb solder. Design/methodology/approach -The basis of the paper is the synthesis of previous studies. In terms of some binary high temperature solder alloys, such as Au-20Sn, Bi-2.5Ag, Sn-5Sb, Au-12.5Ge, Zn-6Al and Zn-Sn, taking the alloy phase diagram as the starting point, the melting characteristics, microstructure, mechanical properties, wetting ability and reliability of solder joint are analysed and the prospect is consequently indicated. Findings -Based on the analysis of the six groups of Pb-free solders, the present binary system solder alloys, from the perspective of melting properties, mechanical properties, soldering or reliability of solder joint, rarely meet the comprehensive requirements of replacing the high-temperature Sn-Pb solder. It is assumed to be a solution that multiple-system Pb-free solders derive from a variety of binary system solders by means of alloying. The future development of high temperature Pb-free solder may focus on some factors such as physical properties, mechanical properties, processing, reliability of solder joint, environmental performance and expense. Originality/value -The paper concentrates on the issue of Pb-free solders at high temperature. From a specific perspective of binary system solders, the presently available Pb-free solders are suggested from the starting point of the alloy phase diagram and the prospect of alternatives of Sn-Pb solders at high temperature are indicated.Changhua Du one of the well-known experts in the field of Micro Electronic Connection and Welding Technology, and he is a Professor in School of Materials Science and Engineering, Chongqing University of Technology. With rich experience of working in enterprise and university, he has worked in the area for a long time, taken charge of some projects for the government ...

Wetting properties of Nd:YAG laser treated copper by SAC solders

“…Although great effort has been made for more than 10 years to get Pb out of the electronic industry, until now, there are still some tough barriers needed to override for a widespread and uniform industrial acceptance of favourable solder alloys and matched materials plus processes (Garner et al, 2000;Casey and Pecht, 2002). Pb-free alloys are used exercising tremendous caution nowadays (compared to the wellestablished Sn-Pb soldering system) because of the lack of legislation, the high cost and insufficient backup data on the usage of such alloys (Zhong et al, 2006;Du et al, 2015). Therefore a lot of investigations deal with lead-free soldering and properties of soldered joints made using lead-free solders (Chen et al, 2015;Du et al, 2015).…”

“…Pb-free alloys are used exercising tremendous caution nowadays (compared to the wellestablished Sn-Pb soldering system) because of the lack of legislation, the high cost and insufficient backup data on the usage of such alloys (Zhong et al, 2006;Du et al, 2015). Therefore a lot of investigations deal with lead-free soldering and properties of soldered joints made using lead-free solders (Chen et al, 2015;Du et al, 2015). The Sn-Ag-Cu system is one of the potential choices recommended by some organizations (Zhong et al, 2006, Koscielski andSitek, 2014).…”

Heat resistant Bi-Ag-X solders for power IC die attachment

“…Nano-Ag pastes and transient liquid phase bonding have also been suggested as potential options [1][2][3][4]. Among these alternatives, Au-based solders have the drawbacks of high price, poor workability and inferior wetting, indicating that they are unlikely to replace high Pb solders.…”

A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders

“…However, none of them can fulfill all the requirements to replace high-Pb content solders. [2][3][4] The In/Sn/Metal multilayer structure substrate bonded with Pb-free solders has been successfully adopted in electronic packaging. [5][6][7] Yan et al concluded that the In-48Sn solder bonded strongly with a Cu substrate, which was proven by fractures occurring at solders instead of at interfacial regions in shear testing.…”