Research of Factors Influencing the Process of Formation of Welded Microconnections in Electronic Modules

Abstract

The features of the formation of microconnections in electronic modules on an aluminum-polyimide basis by the method of ultrasonic welding, which allows to obtain reliable mounting joints of different thickness aluminum without preliminary removal of oxide films where the use of contact welding and soldering are practically difficult or impossible, are investigated. The influence of technological modes (power of an ultrasonic generator, oscillation amplitude of a welding tip (tool), welding force and welding time) on the reliability of mounting microconnections is considered.

Mathematical Model of the Development of Manufacturing Defects in the Surface Layer of Substrates of Moems’ Functional Components

“…Real estimates corresponding to the beginning of the process can be made only after a set of statistical data (roughly 4  n ) regarding the deviation of the real trajectory from that calculated on the basis of the selected model, the corresponding mathematical expectations are naturally selected as estimates [33][34][35][36][37]. The random component z is observed in the form of forecast errors, then it can be assumed that at the initial moment of estimation…”

“…, it is possible to estimate the probability P of a prediction error, or vice versa, the error interval z  for a given probability of finding an error in this interval, using this probability as a guarantee of decisions about the technical state of the functional substrates of MOEMS components, using the expression (34):…”

Simulation Model of Technological Process of Radio Electronics Products Assembly on the Basis of Flexible Switching Structures

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Modern technologies of assembling radio electronic products based on aluminumpolyamide flexible switching structures (FSS) are a complex set of technological problems related to the development of new design technological principles for the design of technological processes (TP), ensuring their reliability, controllability [1][2][3][4]. The problem of providing the necessary levels of quality and technical excellence of manufactured electronic products aims at the use of effective methods of assembling elements of functional electronics on flexible boards-bases [5][6][7], at improving the methods of modeling TP assembly, which must provide high informativeness and reliability [8][9][10][11]. It is necessary to develop an effective mathematical support for modeling the functioning and evaluation of the reliability of TP assembly and installation of FSS-based electronic products.

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