Research of Typical Electronic Package Warpage based on GA

Abstract

Abstract. In order to reduce the warpage value of the electronic package device under the temperature load, improve the reliability of the device. The finite element analysis model of the typical electronic package device was established, and loaded finite element analysis of temperature, obtained the warpage value of the top and middle part of the package structure. 16 different combinations of different parameters were designed by orthogonal design, and the finite element analysis model was established, the corresponding warpage values were obtained and the neural network fitting was carried out. On this basis, the use of genetic algorithm to optimize the material size to achieve the purpose of reducing the amount of warpage. The results showed that the method can greatly reduce the time and ensure accuracy in the package design. And this method provides a new way for the design of the electronic.