Research on BNNTs/Epoxy/Silicone Ternary Composite Systems for High Thermal Conductivity

Lee, Hua; Shi, Qian; Chen, Jia

doi:10.1088/1757-899x/381/1/012076

Cited by 4 publications

(7 citation statements)

References 15 publications

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“…Interest in boron nitride nanotubes (BNNTs) has grown dramatically over the past two decades because of their unique mechanical and thermal properties. , Like carbon nanotubes, BNNTs display exceptional strength, an axial Young’s modulus of up to 1.3 TPa, and thermal stability in air up to 800 °C. − Despite being an electrically insulating semiconductor with a 5–6 eV bandgap, − BNNTs have been suggested to feature a surprisingly high thermal conductivity of 3000 W m –1 K –1 . These properties make BNNTs a highly promising material for thermal management applications in high power electronics and photonics.…”

Section: Introductionmentioning

confidence: 99%

“…4−13 Despite being an electrically insulating semiconductor with a 5−6 eV bandgap, 14−16 BNNTs have been suggested to feature a surprisingly high thermal conductivity of 3000 W m −1 K −1 . 17 These properties make BNNTs a highly promising material for thermal management applications in high power electronics and photonics. They are also a strong candidate for hydrogen storage, 18,19 structural reinforcement of composites and alloys, 4,20 water treatment and desalination, 21 and deep UV optoelectronics.…”

Section: ■ Introductionmentioning

confidence: 99%

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High-Purity Boron Nitride Nanotubes via High-Yield Hydrocarbon Solvent Processing

et al. 2019

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Boron nitride nanotubes (BNNTs) are highly interesting for structural, thermal, and biomedical applications but have, thus, far been limited due to a lack of highyield methods to produce a purified material. In particular, previous attempts have failed to fully remove h-BN due to its chemical similarity with the BNNTs. Here, we propose a mild, high-yield method that removes >99% of the h-BN impurities without any apparent loss or damage to the BNNTs. This is in contrast to all prior methods, which have used aggressive chemical, mechanical, or thermal methods and, therefore, suffered from low yields and significant damage to the tubes. Our method relies on exposure to heptane at a moderate temperature of T = 90 °C in a pressure vessel to detach h-BN impurities from the BNNTs. We showed that X-ray diffraction and Raman spectroscopy are very effective to quantitatively detect the degree of h-BN removal.

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Section: Introductionmentioning

confidence: 99%

Section: ■ Introductionmentioning

confidence: 99%

High-Purity Boron Nitride Nanotubes via High-Yield Hydrocarbon Solvent Processing

et al. 2019

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“…In recent years, as electrical components and electronic devices have become more miniaturized with high performance, the needs for heat dissipation have been dramatically increased to prevent malfunctions of devices 1–7 . Heat dissipation materials are mostly composed of polymer‐based matrix and high thermal conductive fillers such as metal particles, ceramic materials, and carbon materials 5–20 . The thermal conductivity of these composites could be controlled by various factors such as the amount of the fillers, thermal conductivity of fillers, thermal conductivity of resins, and defects at interfaces 21–28 .…”

Section: Introductionmentioning

confidence: 99%

“…This could be achieved by improving crystallinity of the resin which can minimize loss of phonon by defects 28–30 . For example, general epoxy resins show the thermal conductivity from 0.10 to 0.21 20,29,31–34 . In contrast, crystalline or liquid crystal epoxy show high thermal conductivity from 0.31 to 0.38 W/mK due to increased crystallinity of resins 9,29,35,36 .…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4][5][6][7] Heat dissipation materials are mostly composed of polymer-based matrix and high thermal conductive fillers such as metal particles, ceramic materials, and carbon materials. [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] The thermal conductivity of these composites could be controlled by various factors such as the amount of the fillers, thermal conductivity of fillers, thermal conductivity of resins, and defects at interfaces. [21][22][23][24][25][26][27][28] In general, the use of large amount of fillers causes high cost for processing and lowers physical properties although the thermal conductivity of composites increases as amount of fillers increases.…”

Section: Introductionmentioning

confidence: 99%

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Synthesis and characterization of a contorted hexabenzocoronene epoxy toward high thermal stability and thermal conductivity

Kang

Lee

Kim

et al. 2023

Bulletin Korean Chem Soc

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A contorted hexabenzocorone (HBC) mesogen based epoxy was synthesized and characterized for high thermal stability and thermal conductivity. Since HBC has a nano‐graphene like structure, which would have strong pi–pi interactions, it was expected that HBC epoxy would have superior heat resistance and thermal conductivity. Based on this hypothesis, HBC containing four epoxy groups at edges was synthesized and confirmed by NMR and mass spectrum. HBC epoxy was cured with diaminophenolsulfone and their thermal stability and thermal conductivity were investigated. As expected, the decomposition of 5 wt% occurred at 323.44°C, and thermal conductivity was 0.32 W/mK where the general thermal conductivity of epoxy resins is around 0.2 W/mK. Such enhancement of thermal properties would be explained by the formation of pi–pi stacking of HBC mesogens.

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Boron Nitride Nanotubes Toughen Silica Ceramics

Anjum,

Wang,

Gou

et al. 2024

ACS Appl. Eng. Mater.

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Boron nitride nanotubes (BNNTs) are promising reinforcing fillers for ceramics because of their extraordinary structural and mechanical properties and thermal stability, but their reinforcing mechanisms remain elusive. Here, we investigate how BNNTs reinforce silica nanocomposites by quantifying their bulk and interfacial mechanical properties using in situ Raman micromechanical characterization techniques and microstructural analysis. Our studies reveal that the incorporation of small amounts of BNNTs (0.1 to 0.5 wt %) substantially increases the flexural strength (∼51 to ∼153%) and fracture toughness (∼54 to ∼167%) of silica. The effective interfacial shear stress in the bulk BNNTsilica nanocomposite follows a shear-lag model, with a maximum value of ∼92 MPa. The microstructural analysis reveals that incorporating BNNTs in silica has a prominent influence on its crystallization, with a noticeable increase in porosity and a decrease in crystal size and lattice strain. The collective microstructural changes substantially contribute to the bulk mechanical properties of the BNNT-silica nanocomposite. These findings provide insights into the reinforcement mechanism of BNNTs in ceramics and contribute to the optimal design of light, strong, tough, and durable ceramic materials.

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Research on BNNTs/Epoxy/Silicone Ternary Composite Systems for High Thermal Conductivity

Cited by 4 publications

References 15 publications

High-Purity Boron Nitride Nanotubes via High-Yield Hydrocarbon Solvent Processing

High-Purity Boron Nitride Nanotubes via High-Yield Hydrocarbon Solvent Processing

Synthesis and characterization of a contorted hexabenzocoronene epoxy toward high thermal stability and thermal conductivity

Boron Nitride Nanotubes Toughen Silica Ceramics

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