Research on Grounded Coplanar Waveguide for Calibration of Digital Real-time Oscilloscope Probe

Zhu, Jinghan; Zheng, Xiangrui; Zhao, Kun; Wan, Zhaotong

doi:10.1109/icemi52946.2021.9679534

Cited by 2 publications

(5 citation statements)

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“…Consequently, the electrical contact is improved by ensuring a clean and conductive interface and a better electrical contact is facilitated. In addition, it results in visible marks on the solder ball bump's surface, known as ball marks, which serve as indicators of contact quality and can be visually inspected to ensure proper contact during testing [7].…”

Section: Proposed Circuit Design Of For Wlcsp Test a Design Of The Co...mentioning

confidence: 99%

Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines

Kim

Yook

Kim³

et al. 2023

IEEE Access

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Wafer-level chip-scale packages have been extensively adopted in the electronic packaging industry owing to their ability to enhance device performance. This study proposes a novel radio frequency probe card designed for wafer-level chip-scale package testing for frequency of up to 8 GHz, employing polyimide-based grounded coplanar waveguide transmission lines. A hybrid grounded coplanar waveguide is used, wherein the width of the transmission lines and the shape of the ground design are varied to accommodate the current carrying capacity required for high radio frequency power channels. Based on a hybrid design concept, a hybrid grounded coplanar waveguide circuit is fabricated using polyimide-based multilayers via a one-time built-up process, utilizing three-dimensional Micro electromechanical systems technique. This fabrication ensures a robust structure extending up to the contact tip, thereby providing reliable signal transmission and integrity. Moreover, the design incorporates various factors that are critical to signal integrity including impedance matching, scattering parameters, and jitters. The performance of the proposed probe card is validated via comprehensive simulations and measurements, and the feasibility and effectiveness of the design is demonstrated through suitable experiments. The obtained results confirm exceptional performance of the proposed probe card in Wafer-level chip-scale package testing scenarios and demonstrates its appropriateness for a wide range of Wafer-level chip-scale package testing applications up to 8 GHz. Moreover, its ability to ensure reliable signal transmission, coupled with its consideration of key signal integrity parameters, entails it as a valuable tool in the electronic packaging industry.INDEX TERMS RF probe card, GCPW, 3D MEMS, polyimide-based transmission lines, WLCSP test, signal integrity.

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Section: Proposed Circuit Design Of For Wlcsp Test a Design Of The Co...mentioning

confidence: 99%

Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines

Kim

Yook

Kim³

et al. 2023

IEEE Access

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show abstract

“…Based on [2], the dielectric material of GCPW is determined to be RO4003C, the dielectric constant ( r ε ) of RO4003C substrate is 3.38, the thickness of the substrate (h) is 8 mm, the width of the signal conductor (S) is 0.35 mm, the width of slot line (G) is 0.2 mm, the width (W) is 500 mil, and the length (L) is 24 mm. Figure 3 shows the simulated S21 and S11 curves for the GCPW without the through-hole.…”

Section: Mechanism Of How Gcpw's Through-hole Structure Spreads Its B...mentioning

confidence: 99%

“…where c is the speed of light; f max is the maximum frequency; and ε r is the dielectric constant of the substrate material. The bandwidth of the GCPW studied in the simulation of this paper is 67 GHz, and the maximum spacing between through-holes (VD max ) is calculated to be 1.2 mm using Equation (2). Based on the above discussion, the simulation is chosen in the range of VD ≤ 1 mm.…”

Section: Research and Design Of The Through-hole Structure To Widen T...mentioning

confidence: 99%

“…Other parameters are VE1 = VE2 = 0.3 mm, VD = 0.692 mm, VL = 0.246 mm, VR = 10 mil, and RD = 0.854 mm. The process of determining other parameters: first add a single-row through-hole array, determine the number of throughholes and the radius of the single-row through-hole array according to the parameters of the 50 GHz GCPW proposed by Jiangmiao Zhu [2], then extend the GCPW bandwidth by adjusting the VL, VD and VE parameters, and then extend the bandwidth to 67 GHz by increasing the number of through-hole arrays and adjusting the RD parameters. The parameters of single-row through-hole array GCPW are denser than those of the doublerow and triple-row through-hole array GCPWs.…”

Section: Main Parameters Of Double-row and Triple-row Through-hole Ar...mentioning

confidence: 99%

“…The study of using GCPWs with through-hole arrays as test plates to calibrate probes has received increasing attention, and published studies have reported that the bandwidth of GCPWs typically reaches 50 GHz [2] or 40 GHz [3,4]. The wider the bandwidth, the more stringent the size and structure requirements of the GCPW.…”

Section: Introductionmentioning

confidence: 99%

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Method to Change the Through-Hole Structure to Broaden Grounded Coplanar Waveguide Bandwidth

Zhu

Wan

Zhao

2023

Sensors

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A grounded coplanar waveguide (GCPW), as a millimeter wave special transmission line, can be used to calibrate broadband oscilloscope probes. A method to change the through-hole structure to widen the GCPW is investigated in this paper. The effect of the through-hole array on the band-width of the GCPW is investigated and verified using COMSOL Multiphysics simulation software. Finally, the S-parameters of the fabricated GCPWs are measured by a vector network analyzer, and the results show that they have an insertion loss > −3 dB and return loss < −10 dB in the frequency range of DC to 60 GHz, which satisfies the design requirements.

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Research on Grounded Coplanar Waveguide for Calibration of Digital Real-time Oscilloscope Probe

Cited by 2 publications

References 4 publications

Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines

Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines

Method to Change the Through-Hole Structure to Broaden Grounded Coplanar Waveguide Bandwidth

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