Research on heat transfer and flow distribution of parallel-configured microchannel heat sinks for arrayed chip heat dissipation

Hu, Chengyu; Yang, Xiaoping; Ma, Zihuan; Ma, Xiang; Feng, Yali; Wei, Jinjia

doi:10.1016/j.applthermaleng.2024.124003

Applied Thermal Engineering

2024

DOI: 10.1016/j.applthermaleng.2024.124003

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Research on heat transfer and flow distribution of parallel-configured microchannel heat sinks for arrayed chip heat dissipation

Chengyu Hu,

Xiaoping Yang,

Zihuan Ma

et al.

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2025

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Cited by 6 publications

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Heat transfer performance of microchannel heat sink with combined manifolds and bottom wall structures

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Experimental study on the performance of cascaded separate microchannel heat pipes for data center cooling

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Research on heat transfer and flow distribution of parallel-configured microchannel heat sinks for arrayed chip heat dissipation

Cited by 6 publications

References 38 publications

Heat transfer performance of microchannel heat sink with combined manifolds and bottom wall structures

Heat transfer performance of microchannel heat sink with combined manifolds and bottom wall structures

Numerical analysis of thermal and hydraulic characteristics of flow boiling in oblique interconnected microchannel heat sinks

Experimental study on the performance of cascaded separate microchannel heat pipes for data center cooling

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