Research on LED Performance of Glass Substrate with COB Packaging

By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages with different materials and structures. Using the theory of LED illuminance and uniformity, the illuminance of some structures is computed. The results show that the change of substrate material and structure can greatly impact heat dissipation, while changing array forms has little effect on heat dissipation. By improving the spatial distribution of the chip, the temperature superposition problem of the substrate is solved, and the illuminance and uniformity are improved while dissipating heat. The LED filaments of the combined, equidistant, chip-distribution mode have improved heat dissipation. The S-type equal difference has the highest illumination and high illumination uniformity.

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Research on Heat Dissipation of Multi-Chip LED Filament Package

Tan

Liu

She

et al. 2021

Micromachines

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Research and Optimization Design of Thermal Management for LED

Jiang

2023

HSET

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LED, a lighting source that has gained popularity in the 21st century, possesses characteristics such as energy efficiency, eco-friendliness, compactness, and durability. However, its electro-optical conversion efficiency remains relatively low, as approximately 80% to 90% of the input power is dissipated as thermal energy. Consequently, the temperature of the LED rises, leading to a decrease in its luminous efficiency. Hence, it is crucial to conduct research on efficient heat dissipation methods for LEDs. We have compiled research plans from various scientific institutions and observed that through optimized design, the heat dissipation capability of LEDs has significantly improved. This improvement has resulted in reduced thermal stress within the chips and packaging, ultimately enhancing their reliability.

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Research on LED Performance of Glass Substrate with COB Packaging

Cited by 2 publications

References 6 publications

Research on Heat Dissipation of Multi-Chip LED Filament Package

Research on Heat Dissipation of Multi-Chip LED Filament Package

Research and Optimization Design of Thermal Management for LED

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