Research on passive cooling of electronic chips based on PCM: A review

Wu, Haoting; Zhang, Liyu; Zhang, Xuelai

doi:10.1016/j.molliq.2021.117183

Cited by 111 publications

(14 citation statements)

References 85 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this regard, the transient thermal analysis is crucial to avoiding the overdesign of TMS in which the peak and valley thermal capacities fluctuate with varying magnitudes. In this scenario, PCMs do present particular advantages to cope with such problems [148,149].…”

Section: Phase Change Materials (Pcms)mentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

View full text Add to dashboard Cite

In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.

show abstract

Section: Phase Change Materials (Pcms)mentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

View full text Add to dashboard Cite

show abstract

“…Although organic PCMs have significant features of chemical stability, noncorrosive, thermophysical properties, thermal diffusivity, latent heat capacity, and low cost [18]. PCMs are now used in building thermal comfort [19], lithium batteries [20], solar thermal systems [21], electronics chips cooling [22], air conditioning systems [23], refrigeration [24], heat pumps [25] and textiles [26]. Low thermal conductivity limits their performances in heat transfer applications.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices

Zahid

Farooq

Asim

et al. 2023

Case Studies in Thermal Engineering

View full text Add to dashboard Cite

“…The need to remove heat fluxes at a rate equal or greater than the generated one is linked to their temperature increase, which can lead to reduction of reliability and performance, and at worst to a failure. In several electronics cooling applications, e.g., temperature stabilization during pulsed operation, short-term thermal storage, and protection from failure during the loss of coolant scenarios, PCM-based heat sinks can be well-suited solutions because of their capability of absorbing the generated waste heat in the absence of high thermal gradients [3]. These passive devices take advantage of the PCM latent heat, at least two orders of magnitude higher than the sensible energy that can be stored by other materials.…”

Section: Introductionmentioning

confidence: 99%

Design of PCM-based heat sinks through topology optimization

Bianco

Fragnito

Iasiello

et al. 2023

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

Ever-increasing heat fluxes of electronic components ask for higher performance of devices responsible for their cooling. Against that background, PCM-based heat sinks – because of their compactness, and effectiveness – are well-established solutions for thermal management issues. Even though solutions for the thermal enhancement of PCM devices have been widely presented, new ways to optimize such systems are emerging. Among them, this work investigates the application of density-based topology optimization to define innovative heat sinks design able to minimize thermal resistance under constant wall temperature. A 2D numerical model is developed by means of a finite element tool. The heat equation is solved for the topology optimization problem with the objective of minimizing the average temperature, considering further manufacturing restrictions. Solid-isotropic-material-with-penalization (SIMP) method is applied to link the design variable to material properties. Parameterization of Helmholtz filter’s minimum feature size and projection based on the hyperbolic tangent function is performed, showing improved performance as well as feature size decrease. The optimized prototype – with PCM – is then simulated with the enthalpy-porosity model to assess the benefits, i.e., reduction in the melting time, with respect to the baseline. Results show the potential of optimizing heat sinks via a topology-based approach and confirm it as a promising tool for finding new heat sink geometry, whatever the application.

show abstract

Research on passive cooling of electronic chips based on PCM: A review

Cited by 111 publications

References 85 publications

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices

Design of PCM-based heat sinks through topology optimization

Contact Info

Product

Resources

About