Research on Reliability of Solder Layer in IGBT Module Packaging

Chi, Panwang; Lin, Shiquan; Li, Yesu; Liu, Yiping; Lu, Jicun; Li, Ming; Gao, Liming

doi:10.1109/icept52650.2021.9567959

2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 2021

DOI: 10.1109/icept52650.2021.9567959

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Research on Reliability of Solder Layer in IGBT Module Packaging

Panwang Chi

Shiquan Lin

Yesu Li

et al.

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Research on Reliability of Solder Layer in IGBT Module Packaging

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References 12 publications

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