Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

Abstract

To address the issues of high cost, low welding efficiency, and complex processes in vacuum brazing, we proposed a method of electromagnetic ultrasonic (EU)-assisted brazing with Al-12Si solder to join SiC ceramic and TC4 alloy. The results showed that the maximum magnetic induction strength (MIS) on the surface of the liquid solder was 0.629 T when subjected to a static and alternating magnetic field (MF). Additionally, the combined action of MF and eddy current generated a downward Lorentz force (LF) in the liquid solder, with the maximum LF in the horizontal and vertical directions being 48.91 kN m−3 and 60.93 kN m−3, respectively. Under the influence of an EU wave, the liquid solder exhibited capillary filling (CF) behavior. At 26 ms, the maximum length of CF was 12.21 mm.