“…Towards achieving this objective, sealed electronic devices are manufactured and tested in accordance with the controls and requirements of applicable military standards and specifications. One critical factor that can cause short-circuit, device malfunction, or even catastrophic system failure is loose particles in the form of foreign material, such as the wire pieces, chip dregs, aluminum scraps and tin splatters, being left within sealed electronic devices during pre-seal handing and assembly process [1][2][3]. Therefore, it is critical to investigate loose particle detection technology including loose particle detection and material recognition.…”