Research Progress and Application of Polyimide-Based Nanocomposites

Abstract

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

Construction of fluorenyl‐modified low dielectric constant polyimide films with excellent mechanical properties and optical transparency

“…6 Known as high-performance engineering plastics, aromatic polyimides (PIs) are widely utilized in the microelectronics sector as flexible circuitry substrates, stress buffers, interlayer dielectrics, and passivation layers due to their satisfactory thermal stability, chemical resistance, dimensional stability, and electric properties. [7][8][9][10] It is regarded as one of the most promising alternatives for the next interlayer dielectric technology. 11 However, intermolecular charge-transfer complexes formed by alternating electron-donating diamines and electron-accepting dianhydrides in PIs often result in higher dielectric constants, which makes it harder to meet the requirements of the microelectronics industry, so it is vital to further reduce the dielectric constant of PI materials.…”

“…Known as high‐performance engineering plastics, aromatic polyimides (PIs) are widely utilized in the microelectronics sector as flexible circuitry substrates, stress buffers, interlayer dielectrics, and passivation layers due to their satisfactory thermal stability, chemical resistance, dimensional stability, and electric properties 7–10 . It is regarded as one of the most promising alternatives for the next interlayer dielectric technology 11 .…”

A study on the electromagnetic mechanism of a flexible terahertz toroidal dipole metasurfaces

“…In order to study the intrinsic mechanism of TD resonance more deeply, the scattering power and Q-factor of the multipole are also calculated for a more in-depth discussion.TD MSs with high transmittance are of great research value for the fabrication of terahertz devices. Polyimide is used as a substrate for metamaterials because of its properties such as high transparency in terahertz and visible wavelength bands, low density, low dielectric constant, and ease of realizing processing [47].The MSs structure consists of two symmetric split rings along the Y-axis, where the outer radius of the split ring is R = 205 μm, and the inner radius is SR = 199 μm, respectively. And a metal strip is 189 μm length 20 μm width, which is placed in the middle of the open semicircular ring with an intermediate opening g = 20 μm.…”

Heterogeneous Model for Precursor-Mediated Nanoparticle Growth in Polymer Film

“…The recent interest to the polymeric nanocomposite materials owes to their unique mechanical, chemical, electro-dynamical, and optical properties relevant for numerous applications. − …”