2023
DOI: 10.1039/d2ce01539k
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Research progress in the postprocessing and application of GaN crystal

Abstract: This manuscript systematically reviews the importance of wet etching and thermal annealing in GaN crystal applications for the first time.

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Cited by 6 publications
(1 citation statement)
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“…In recent years, with the breakthrough of GaN material growth technology, 4 inch and even 6 inch GaN wafers have started to enter the commercialization stage. In this context, the optimization of vertical GaN-based SBD mainly lies in three parts: substrate quality, termination structure and drift layer, and due to the limitation of material growth level, the dislocation density of GaN substrate is generally 10 4 -10 6 cm −2 at present, which is much larger than that of Si and SiC [14,67]. In 2019, Gu et al [68] tried to take advantage of the feature that Ge has a smaller atomic radius than Si and used Ge instead of Si as the doping element of N + -GaN substrate to fabricate a vertical GaN-based SBD.…”
Section: Vertical Structure Gan-based Sbdmentioning
confidence: 99%
“…In recent years, with the breakthrough of GaN material growth technology, 4 inch and even 6 inch GaN wafers have started to enter the commercialization stage. In this context, the optimization of vertical GaN-based SBD mainly lies in three parts: substrate quality, termination structure and drift layer, and due to the limitation of material growth level, the dislocation density of GaN substrate is generally 10 4 -10 6 cm −2 at present, which is much larger than that of Si and SiC [14,67]. In 2019, Gu et al [68] tried to take advantage of the feature that Ge has a smaller atomic radius than Si and used Ge instead of Si as the doping element of N + -GaN substrate to fabricate a vertical GaN-based SBD.…”
Section: Vertical Structure Gan-based Sbdmentioning
confidence: 99%