Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

Zhang, Li; Zhang, Chong; Tan, Zheng Hui Ernest; Tang, Jingrong; Yao, Chen; Hao, Bin

doi:10.3390/mi12111358

Cited by 12 publications

(4 citation statements)

References 90 publications

(210 reference statements)

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“…This limitation prevents the integration of multiple functionalities on the device, greatly restricting its practicality. Therefore, it is essential to prioritize the research and design of multilayer flexible electronic devices [ 126 , 127 , 128 , 129 , 130 ] to overcome these limitations and enhance their functionality.…”

Section: Stacking Process: Complex Multilayer Flexible Device Prepara...mentioning

confidence: 99%

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Han,

Cui,

Liu

et al. 2023

Biosensors

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Given the advancements in modern living standards and technological development, conventional smart devices have proven inadequate in meeting the demands for a high-quality lifestyle. Therefore, a revolution is necessary to overcome this impasse and facilitate the emergence of flexible electronics. Specifically, there is a growing focus on health detection, necessitating advanced flexible preparation technology for biosensor-based smart wearable devices. Nowadays, numerous flexible products are available on the market, such as electronic devices with flexible connections, bendable LED light arrays, and flexible radio frequency electronic tags for storing information. The manufacturing process of these devices is relatively straightforward, and their integration is uncomplicated. However, their functionality remains limited. Further research is necessary for the development of more intricate applications, such as intelligent wearables and energy storage systems. Taking smart wear as an example, it is worth noting that the current mainstream products on the market primarily consist of bracelet-type health testing equipment. They exhibit limited flexibility and can only be worn on the wrist for measurement purposes, which greatly limits their application diversity. Flexible energy storage and flexible display also face the same problem, so there is still a lot of room for development in the field of flexible electronics manufacturing. In this review, we provide a brief overview of the developmental history of flexible devices, systematically summarizing representative preparation methods and typical applications, identifying challenges, proposing solutions, and offering prospects for future development.

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Section: Stacking Process: Complex Multilayer Flexible Device Prepara...mentioning

confidence: 99%

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Han,

Cui,

Liu

et al. 2023

Biosensors

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“…2 illustrates the fabrication of the micropillar-pumped polymer LHP. The device is fabricated from polydimethylsiloxane, which is compatible with flexible electronics [13]. The micropillar wick and other components of the polymer LHP are fabricated via soft lithography.…”

Section: Design Concept and Fabricationmentioning

confidence: 99%

Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe

Hashimoto,

Kawakami,

Alasli

et al. 2023

J. Microelectromech. Syst.

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This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 • C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation.[2023-0140]Index Terms-Flexible electronics, micropillar wick, polymer loop heat pipe, two-phase heat transfer.

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“…The micro-transfer printing (µTP) is one promising mass transfer technology that has achieved ∼99.99% transfer yield and 1.5 µm position precision [3]. The µTP technology with extensive target substrates and plenty of materials and forms of inks is highly compatible with the current technologies in semiconductor industry and is expected to be able to realize large-scale rapid integration of heterogeneous materials [4], having demonstrated potential applications in many fields including flexible micro-LED display [5], stretchable and foldable Si-CMOS circuit [6], flexible epidermal electronics [7], flexible neural electrode arrays [8], bionic electronic eye cameras [9], and flexible photovoltaic modules [10], etc.…”

Section: Introductionmentioning

confidence: 99%

Viscoelasticity, stiffness gradient and their effects on adhesion of an epoxy shape memory polymer

Gong,

Wang

2024

Smart Mater. Struct.

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The shape memory polymer based adhesives have demonstrated excellent programmable switchable adhesion, in which the material properties play an important role. Here, the viscoelasticity, stiffness gradient, and their effects on adhesion of an epoxy shape memory polymer (ESMP) were studied. The ESMP sample and polydimethylsiloxane (PDMS) control sample were fabricated firstly by mold casting and curing techniques. The sample was fixed on an electric heating plate with double-sided tape to conduct the adhesion measurements against a hemispherical glass indenter under different temperature and displacement conditions by using an adhesion tester and the temperature measurements on the double-sided tape and ESMP sample surfaces by using a digital thermodetector. Based on the measured force-displacement-time data, the hysteresis behavior and internal dissipation were evaluated; the peak force relaxation was studied; the reduced modulus was calculated and the stiffness gradient features were evaluated. The results show that the ESMP sample exhibits strong viscoelasticity and significantly enhanced adhesion that strongly depends on the compressive displacement in the glass-rubber transition zone near it's glass transition temperature (T_g), while weaker viscoelasticity and lower adhesion in the soft rubbery state. The reduced modulus of the ESMP sample obviously decreases with the increasing compressive displacement at a preset temperature below 70 ℃. It is found that there exists a linear relation between the pull-off force, effective work of adhesion, reduced modulus, and contact area. This study helps deeply understand the material properties and adhesion mechanism of the ESMP, which can guide the design of switchable adhesives.

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Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

Cited by 12 publications

References 90 publications

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe

Viscoelasticity, stiffness gradient and their effects on adhesion of an epoxy shape memory polymer

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