Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Zhang, Yuemin; Guo, Haiyun; Cao, Jun; Wu, Xuefeng; Jia, Hewei; Chang, Andong

doi:10.3390/mi14081538

Cited by 6 publications

(2 citation statements)

References 95 publications

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“…Mitsubishi Electric Corporation [ 17 ] has invented a Ni-coated Cu wire that exhibits a certain level of reliability in experiments. A comparison was made between Pt, Pd, and Ni coatings on Cu wire, and the results revealed that PCC wire exhibited the best performance, with stronger oxidation resistance than Ni, better processability than Pt, higher mechanical strength than pure Cu-bonding wire, moderate hardness, and excellent bonding ball formation [ 18 , 19 ]. In terms of electrical characteristics, PCC wire and bare Cu wire have similar electrical resistances, and their melting currents are almost the same [ 20 , 21 ].…”

Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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“…As an alternative line, the Cu bonding wire has higher conductivity, thermal conductivity, and lower cost than Au and has good electrical connection potential in high power and high integration electronic devices [12][13][14][15][16][17]. Compared with Au wire, Cu wire has better electrothermal performance, higher pull force, and loop stability, allowing for thinner wires to fit a smaller pad size, and the growth rate of harmful intermetallics in Cu-Al is less than one-fifth of that in Au-Al, which greatly improves chip lifetime and reliability [18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

Cao

Zhang

et al. 2023

Micromachines

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The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding Cu strip are gradually broken and refined, and the grains are flattened when the reduction rate is 80%. The tensile strength increased from 248.0 MPa to 425.5 MPa, while the elongation decreased from 8.50% to 0.91%. The growth of lattice defects and grain boundary density results in an approximately linear increase in resistivity. With the increase of annealing temperature to 400 °C, the Cu strip recovers, and the strength decreased from 456.66 MPa to 220.36 MPa while the elongation rose from 1.09% to 24.73%. The tensile strength and elongation decreased to 192.2 MPa and 20.68%, respectively, when the annealing temperature was 550 °C. The trend of yield strength of the Cu strip was basically the same as that of tensile strength. The resistivity of the Cu strip decreased rapidly during a 200~300 °C annealing temperature, then the trend slowed, and the minimum resistivity was 3.60 × 10−8 Ω·m. The optimum tension range annealing was 6–8 g; less or more than that will affect the quality of the Cu strip.

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