Research progress of the liquid cold plate cooling technology for server electronic chips: A review

Abstract

A significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and doublelayered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.

Research on key technology and system application of energy management coupled with liquid cooling and intelligent control algorithm

“…The advantage of this method is that the coolant is not in direct contact with the heating source, which can avoid problems such as electrical short circuit. Immersion liquid cooling technology is to soak the server directly in the coolant, through the coolant directly absorb the heat generated by the server and cycle out [11] . The advantage of this method is that it has high heat dissipation efficiency and is suitable for data centers with high power density.…”

Study on the Cooling Performance of a Focused Ultrasonic Radiator for Electrical Heating Elements

“…Common methods for cooling electronic devices include heat sinks, liquid cooling system, axial fans, and so on [ 1 , 2 , 3 , 4 ]. However, the high integration, miniaturization, and application situation diversity of electronic devices put forward higher requirements (such as small area heat dissipation, high penetrating capability, or low noise) for cooling system designs [ 5 , 6 , 7 ]. An effective cooling method for small heating elements can not only reduce the structural complexity of cooling systems, but also make cooling systems more energy-efficient.…”

Numerical Investigations of the Cooling Performance of an R410A Closed-Loop Spray Cooling System

“…Currently, more and more compact size results in a high power density in electronic devices. Ten years ago, the heat flux density of electronic chips had reached up to 100 W/cm 2 [1,2], and it is expected to achieve over 1000 W/cm 2 [3][4][5] in the near future. Thermal management technologies like micro-channels, heat pipes, and spray cooling have great potential, among which spray cooling technology stands out due to its high heat dissipation capacity, low surface temperatures, system stability, and cost-effectiveness, attracting widespread attention from researchers [6].…”