Residual stresses of Ni alloy electrodeposits containing low levels of Fe, P, and B

Seo, Moo Hong; Kim, Dong-Jin; Kim, Joung Soo

doi:10.1007/bf03027869

Cited by 7 publications

(2 citation statements)

References 11 publications

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“…input of the workpiece for the next ECAP. The bent workpiece needs additional straightening or surface polishing [23][24][25][26][27] even if the amount of bending is small, and, hence, needs to be controlled during ECAP.…”

Section: Introductionmentioning

confidence: 99%

Finite element analysis of the bending behavior of a workpiece in equal channel angular pressing

2009

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For the first time, a detailed and systematic finite element study was carried to identify the parameters which cause the bending of the workpiece in equal channel angular pressing. These simulations were carried out by using commercial finite element code Abaqus with different materials behavior, processing parameters, and die geometries. The results showed that the optimal ways to reduce the bending of strain rate sensitive materials in ECAP without varying the strain homogeneity are the usage of lower processing speed and the increase in length of the die exit-channel.

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Section: Introductionmentioning

confidence: 99%

Finite element analysis of the bending behavior of a workpiece in equal channel angular pressing

2009

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“…In the experiments within this thesis, residual internal stress was measured using a deposit stress analyser (Model 683EC, Specialty Testing & Development Co.). The flexible bent strip exists as one of the pioneering, simplest and widely used stress determination device [145]. The test strips were made up of nickel and can measure a range of 0.7 -206.8 MPa.…”

Section: Residual Stressmentioning

confidence: 99%

Nickel-based electrodeposits for corrosion protection of smart card contacts

Murugan¹

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Reliability of smart cards depends extensively on the corrosion resistance of the electrical contacts they contain as these contacts are primarily exposed to the environment. Although corrosion as an entirety is a century old problem, the corrosion of thin electrical contacts has been rarely studied in a systematic manner. Cu is typically used as substrate material for electrical contacts and nickel based barrier layer coating have been essential to suppress copper diffusion through the gold topcoat. This thesis aims to bridge knowledge gaps in literature with regards to the corrosion behaviour of Ni and Ni-P barrier coated electrical contacts.Much work has been dedicated to the corrosion resistance of electroless Ni-P deposits but research on electrolytic deposits is limited. The impact of electrodepositing parameters on corrosion resistance has not been well documented. This thesis aids the understanding of the electrodepositing parameters and their implications on corrosion resistance. Moreover, corrosion behaviour due to different arrangement of thin Ni and Ni-P stacks (< 3 μm) is unknown. This thesis also explores different thin Ni and Ni-P stacks and its corrosion resistance to salt spray (SS) and mixed flowing gas (MFG) environments. The corrosion behaviour of these stacks, corrosion mechanism and causes of corrosion disparity have been also discussed in this report. The thesis is bounded by three main considerations viz., method and type of deposition, and corrosion testing methods. Electrodeposition was the choice of deposition technique, Ni and Ni-P electrodeposits were chosen barrier layers and lastly, accelerated tests which simulate atmospheric corrosion were employed.The research starts with a systematic study on the electrodepositing parameters and their influence on the corrosion resistance of electrical contacts. Corrosion products due to the neutral salt spray (NSS) and mixed flowing gas (MFG) tests were characterised through spectroscopic and diffractions studies. Electrical contacts exposed to NSS tests produced green corrosion residues which consist of CuCl (nantokite) and CuCl2(OH)3 Abstract ii (clinoatacamite) and brown residues which consist of Cu2O (cuprite). Electrical contacts exposed to MFG test produces copper sulfides (major) and nickel sulfides (minor). Also increasing the thickness of Ni consistently improved the corrosion resistance in both neutral NSS and MFG corrosion tests. However, the influence of Ni thickness on corrosion was overshadowed by the Ni-P thickness. Increasing the thickness of Ni-P deposits resulted in higher corrosion in the NSS environment and decreased corrosion under the MFG environment. Although initial results pointed towards a disparity that Ni-P may not be suitable for corrosion protection in environments with heavy chlorine concentration but appropriate for sulfur-containing corrosion media, subsequent in-depth studies revealed that this disparity was due to the high edge porosity caused by fast plating. Subsequently, the arrangement of Ni and Ni-P on Cu...

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The disparity of corrosion resistance between Ni/Au and Ni–P/Au electrical contacts in mixed flowing and salt spray tests

et al. 2017

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Residual stresses of Ni alloy electrodeposits containing low levels of Fe, P, and B

Cited by 7 publications

References 11 publications

Finite element analysis of the bending behavior of a workpiece in equal channel angular pressing

Finite element analysis of the bending behavior of a workpiece in equal channel angular pressing

Nickel-based electrodeposits for corrosion protection of smart card contacts

The disparity of corrosion resistance between Ni/Au and Ni–P/Au electrical contacts in mixed flowing and salt spray tests

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