Resist Technology—Design, Processing, and Applications

Helbert, John N.; Daou, Tony

doi:10.1016/b978-081551444-2.50004-5

Cited by 9 publications

(5 citation statements)

References 67 publications

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“…To achieve fast turn-around time of the experimental procedures, we chose photoresist (AZ series from Clarient, Somerville, NJ) as the cavity-filling material and SU-8 (MicroChem Corp., Newton, MA) as the structural material of the scanning probes. Since they are widely used in photolithography, the AZseries photoresists are readily available and their chemical composition, viscosity and spinning characteristics (on flat surfaces) have been thoroughly studied and calibrated [31]. SU-8 is a negative-tone resist, which can form layers with a wide range of thickness and can be directly patterned with photolithography.…”

Section: Process Development Fabrication and Resultsmentioning

confidence: 99%

Microfabrication of colloidal scanning probes with controllable tip radii of curvature

Yapıcı¹,

Zou²

2009

J. Micromech. Microeng.

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We report the first batch-fabrication method to create colloidal scanning probes based on standard micromachining processes. Microfabrication of colloidal probe arrays having smooth surface profiles with radius of curvature ranging from nanometers to tens of microns is successfully demonstrated. A new mold filling technology is developed where bulk-etched cavities with sharp endpoints are transformed into cavities with curved endings via spin coating of a liquid filling material (photoresist). The curved profile is then replicated into a stable metallic mold by evaporating a layer of aluminum, after which mold-transfer scanning probe (SP) fabrication is conducted to create colloidal probes. Multiple control knobs were developed and characterized for accurate control of the tip radius of curvature. By adjusting the solid content of the filling material, the number of spin-coat cycles, and the cavity geometry, different mold profiles and thereby tip radii of curvature were achieved. The new controllable technology allows rapid microfabrication of singular or arrayed colloidal scanning probes with different tip radii of curvature which will be useful for many biological and nanotechnology applications.

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Section: Process Development Fabrication and Resultsmentioning

confidence: 99%

Microfabrication of colloidal scanning probes with controllable tip radii of curvature

Yapıcı¹,

Zou²

2009

J. Micromech. Microeng.

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“…Co., Woollam). Spectra were recorded from 300 to 1000 nm at three incidence angles (50º, 60º, 70º) that were chosen above and below Brewster's angle (angle of vanishing reflection of pwave, which is ≈ 57º for glass [31]) to ensure a maximum difference in the amplitudes of pand s-waves. The spectra were fitted using both the dispersion Cauchy model [32] and Bruggeman effective medium approximation (BEMA) model [33].…”

Section: Referencementioning

confidence: 99%

Polyfluoroalkyl-silica porous coatings with high antireflection properties and low surface free energy for glass in solar energy application

Agustín-Sáenz¹,

Machado²,

Tercjak

2020

Applied Surface Science

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“…As a basis, IC fabrication is obtained through a complex infrastructure of materials supply, waste treatment, logistics, and automation to support the entire process. Specifically, the semiconductor production technology develops through an extensive series of photographical, mechanical, and chemical steps in the cleanest environment, achieved by ultra‐precision engineered equipments 16. Typical processing loops, which may recur several times, comprise some or all of the following phases (Figure 1a): oxidation; photoresist application; exposure to light; development of the resist; etching; and photoresist removal.…”

Section: Photolithography Process and Inspection Toolsmentioning

confidence: 99%

Monitoring roughness and edge shape on semiconductors through multiresolution and multivariate image analysis

et al. 2009

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Photolithography is one of the most important processes in the production of integrated circuits. Usually, attentive inspections are required after this process, but are limited to the measurement of some physical parameters such as the critical dimension and the line edge roughness. In this paper, a novel multiresolution multivariate technique is presented to identify the abnormalities on the surface of a photolithographed device and the location of defects in a sensitive fashion by comparing it to a reference optimum, and generating fast, meaningful and reliable information. After analyzing the semiconductor surface image in different levels of resolutions via wavelet decomposition, the application of multivariate statistical monitoring tools allows the in-depth examination of the imprinted features of the product. A two level nested PCA model is used for surface roughness monitoring, while a new strategy based on ‘‘spatial moving window’’ PCA is proposed to analyze the shape of the patterned surface. The effectiveness of the proposed approach is tested in the case of semiconductor surface SEM images after the photolithography process. The approach is general and can be applied also to inspect a product through different types of images, different phases of the same production systems, or different processes

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Resist Technology—Design, Processing, and Applications

Cited by 9 publications

References 67 publications

Microfabrication of colloidal scanning probes with controllable tip radii of curvature

Microfabrication of colloidal scanning probes with controllable tip radii of curvature

Polyfluoroalkyl-silica porous coatings with high antireflection properties and low surface free energy for glass in solar energy application

Monitoring roughness and edge shape on semiconductors through multiresolution and multivariate image analysis

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